ATS-13G-100-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	8.79°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

The ATS-13G-100-C3-R0 is a thermal heat sink device designed to transfer thermal energy away from the source, using a thin metal surface to disperse the heat. It is a widely used type of heat sink, with a wide range of applications and industries, making it an effective solution for dissipating heat in a limited space.

Application Fields & Working Mechanism

The ATS-13G-100-C3-R0 can be used in a variety of applications. As the size is relatively small, it is often used when space is a concern. It is commonly used in cooling computer and laptop systems, as well as other electronic components like CPU processors, controllers, and RAM cards. As the design of the ATS-13G-100-C3-R0 includes a fibrous layer as well as the metal surface, it can also be used in LED and LCD displays, and is also popular in other equipment which produces a lot of heat.The working principle behind the ATS-13G-100-C3-R0 is quite simple. The metal surface and fibrous layer of the heat sink are designed to transfer heat away from the components, dissipating it away from the device while keeping the temperatures at an acceptable level. This is done by the heat sink absorbing heat from the component, lowering the temperature of the component and allowing it to operate more efficiently. The fibrous layer helps to dissipate the heat away from the source quickly, and the metal surface radiates the heat away from the device, making theATS-13G-100-C3-R0 an effective heat dissipating device.

Design

The ATS-13G-100-C3-R0 is designed with efficiency in mind. The funnels and curved metal surface help to direct the heat away from components, while the fibrous layer serves to dissipate the heat away from the device, and the heat pipes add an additional level of efficiency to keep temperatures at an acceptable level.The design also helps to encourage air flow around the device, allowing for more efficient heat transfer away from the components. The ATS-13G-100-C3-R0 also includes a screwless mounting option, allowing the device to be easily and securely attached to a variety of components.

Conclusion

The ATS-13G-100-C3-R0 is a popular thermal heat sink device, used in a wide range of applications such as cooling computer systems, CPU processors, RAM cards, and other electronic components which produce a lot of heat. The design of the device includes a metal surface and fibrous layer to help promote better heat dissipation, as well as a screwless mounting option for easy installation. With its rugged design and efficient working mechanism, the ATS-13G-100-C3-R0 is an effective solution for dissipating heat quickly and effectively.

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