| Allicdata Part #: | ATS22869-ND |
| Manufacturer Part#: |
ATS-13G-120-C2-R0 |
| Price: | $ 3.95 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13G-120-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.59100 |
| 10 +: | $ 3.49335 |
| 25 +: | $ 3.29918 |
| 50 +: | $ 3.10502 |
| 100 +: | $ 2.91098 |
| 250 +: | $ 2.71691 |
| 500 +: | $ 2.52285 |
| 1000 +: | $ 2.47433 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.48°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are an important component of any electronic cooling system. Heat sinks are used to transfer thermal energy from one component to another, and to dissipate heat away from the system. The ATS-13G-120-C2-R0 is an advanced thermal heat sink designed specifically for extreme heating applications.
The ATS-13G-120-C2-R0 is a two-stage thermal heat sink that provides a high level of thermal performance. It is designed to handle very high temperatures, and is capable of dissipating heat up to 250 watts. The heat sink consists of two sets of cooling fins, each of which is connected to a heatsink base by a series of concentric rings. This design allows for efficient heat dissipation as well as airflow distribution. Additionally, the ATS-13G-120-C2-R0 is constructed from high-grade aluminum for maximum strength and durability.
The ATS-13G-120-C2-R0 is most commonly used in applications where extreme levels of thermal performance are needed. This includes high-performance computing, gaming, overclocking, graphics rendering, and other applications where temperatures may reach above 212°F (100°C). It is also suitable for use in industrial and military applications, as it can achieve thermal performance levels far above what is considered safe operating levels for most components.
The ATS-13G-120-C2-R0 heat sink operates on the principle of thermoelectricity, which is the exchange of thermal and electrical energy. This is accomplished through the use of a thermoelectric module (TE), which consists of a pair of metal plates connected to a semiconductor material. When the plates are heated, electrons are drawn to the hotter surface. As the electrons travel through the semiconductor material, they generate a voltage, which is then used to power the heat sink’s fans. This process helps to quickly and evenly dissipate the heat away from the components, ensuring safe and reliable operation.
The ATS-13G-120-C2-R0 is a top-of-the-line thermal heat sink, and is well suited for the most demanding applications. It has been designed with advanced features to ensure optimal thermal performance and reliability, making it a great choice for high-end applications. The ATS-13G-120-C2-R0 is a highly efficient thermal heat sink, and its performance and longevity make it a great investment for any extreme heating application.
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