| Allicdata Part #: | ATS22875-ND |
| Manufacturer Part#: |
ATS-13G-126-C2-R0 |
| Price: | $ 4.39 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X15MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13G-126-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.99420 |
| 10 +: | $ 3.88647 |
| 25 +: | $ 3.67063 |
| 50 +: | $ 3.45467 |
| 100 +: | $ 3.23870 |
| 250 +: | $ 3.02279 |
| 500 +: | $ 2.80687 |
| 1000 +: | $ 2.75290 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.47°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal-heat sinks play an important role in managing the temperature of electrical and electronic components. They are used to dissipate heat in high-performance components and keep them from being damaged by excessive temperatures. The ATS-13G-126-C2-R0 is one such heat sink.
The ATS-13G-126-C2-R0 is a heat sink with a size of 126 mm x 126 mm x 15.0 mm and a fin pitch of 2.0 mm. It is made of pure copper and has a total weight of approximately 0.79 kg.
It can transfer high-power components to remote air cooling rapidly due to its ability to dissipate heat quickly. It has a heat dissipation effect of up to 130W and can effectively reduce the temperature of electronic components it is attached to.
Additionally, it is designed with a flat bottom surface for ease of installation. It can be secured to the component using screws, clips, or any other type of mount. It also has an improved heat exchange area to enhance the performance of the component by providing greater heat dissipation.
The working principle of the ATS-13G-126-C2-R0 is based on the thermal design principles of conduction, convection, and radiation. Conduction is the transfer of heat through the direct contact of the heat sink with the component. The heat is then dissipated away from the component via convection, which is the transfer of heat through air. Finally, radiation is the transfer of heat in the form of light waves.
Due to its size, robust construction, and thermal efficiency, the ATS-13G-126-C2-R0 is ideal for applications where reliable heat dissipation is needed. It can be used to dissipate heat from applications such as lasers, medical x-ray equipment, communication equipment, industrial machinery, electrical motors, and many other high-power electronic components.
The ATS-13G-126-C2-R0 is a high-quality heat sink designed for reliable heat dissipation in general-purpose electronics. It utilizes advanced thermal designs to dissipate heat quickly and efficiently, while its lightweight construction and flat bottom surface facilitate easy installation and ensure secure mounting.
The specific data is subject to PDF, and the above content is for reference