| Allicdata Part #: | ATS22886-ND |
| Manufacturer Part#: |
ATS-13G-136-C2-R0 |
| Price: | $ 7.88 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X25MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13G-136-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 7.08750 |
| 10 +: | $ 6.69627 |
| 25 +: | $ 6.30252 |
| 50 +: | $ 5.90877 |
| 100 +: | $ 5.51477 |
| 250 +: | $ 5.12089 |
| 500 +: | $ 5.02240 |
| 1000 +: | $ 4.92392 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.18°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management solutions are designed to provide heat dissipation for electronic devices.
The ATS-13G-136-C2-R0 is a heat sink product specifically designed for use with the ATS-13G-136-C2-R0 product. The ATS-13G-136-C2-R0 is a thermal management solution typically used for high-temperature applications.
The ATS-13G-136-C2-R0 is a product of the ATS-13G line of products, which is designed to provide greater thermal performance for small electronics. This series of products utilizes advanced thermal technology to reduce overall operating temperatures.
The ATS-13G-136-C2-R0 is designed to be used in applications that require high-temperature thermal management solutions. This product incorporates a low-profile design, which ensures that it is able to fit into any given space. In addition, it also features an anodized aluminum alloy construction that is designed for long-term durability and reliability.
The ATS-13G-136-C2-R0 is designed to be used in a variety of applications, such as printed circuit boards, networking, mobile devices, and telecommunications. The ATS-13G-136-C2-R0 is capable of thermal management in temperatures ranging from -20°C up to +100°C.
The ATS-13G-136-C2-R0 is designed to work by dissipating heat away from the heat source, providing a much-needed cooling solution for components within a system. This type of heat sink is engineered to reduce heat, helping to keep components within the system from reaching dangerous levels.
The ATS-13G-136-C2-R0 is designed to be used in conjunction with thermal management systems. It can be used with a number of different components to help achieve maximum thermal performance. This type of heat sink can also be used to provide additional cooling for components within a system.
In order to achieve maximum performance, it is important to properly integrate the ATS-13G-136-C2-R0 into a thermal management system. It is important to make sure that there is sufficient thermal contact between the heat sink and the component that is being cooled. This ensures that heat is being efficiently and effectively removed from the component, providing a cooler operation.
The ATS-13G-136-C2-R0 is designed to provide maximum thermal performance in high-temperature applications. It is perfect for components that require efficient heat dissipation and maximum thermal efficiency. This heat sink is designed to provide long-term thermal protection for a wide range of applications.
The specific data is subject to PDF, and the above content is for reference