| Allicdata Part #: | ATS22888-ND |
| Manufacturer Part#: |
ATS-13G-138-C2-R0 |
| Price: | $ 3.40 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X15MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13G-138-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.08700 |
| 10 +: | $ 3.00762 |
| 25 +: | $ 2.92648 |
| 50 +: | $ 2.76381 |
| 100 +: | $ 2.60127 |
| 250 +: | $ 2.43868 |
| 500 +: | $ 2.35738 |
| 1000 +: | $ 2.11351 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.18°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal-Heat Sinks are systems which absorb and move the heat from a hot device and transfer it to cold surrounding air. They are used to reduce the temperature of electronic components that become too hot. ATS-13G-138-C2-R0 Thermal-Heat Sinks are a relatively compact solution for a variety of power semiconductor and discrete application. They are designed to improve thermal performance to increase the longevity of the components and reduce the amount of power they consume.
Design
The ATS-13G-138-C2-R0 Thermal-Heat Sinks are designed to be a two-piece, heat-sink module. The base and the cover of the module are both made of aluminum, promoting good heat transfer methods and excellent dissipation. They come with a saddle clip preassembled to the base for easy mounting, while the cover is sold separately. In addition, they come with two holes on top that enable them to be easily mounted. The design allows for the press fit of the module to any given surface and promotes a lower profile.
Applications
The ATS-13G-138-C2-R0 Thermal-Heat Sinks are designed for use in a range of different components and semiconductor applications. These include applications like power transistors, IGBT transistors, motor control applications, relays, and LED drivers to name a few. The aluminum construction of these modules makes them an ideal choice for applications requiring good thermal conductivity.
Working Principle
The ATS-13G-138-C2-R0 Thermal-Heat Sink works by using the metal frame of the module as a heat sink. Heat is conducted from the electronic components via the bottom of the module into the frame, and then dissipated to the surroundings through its fins. The module also has a protective cover that reduces exposure to the outside environment and prevents dust and debris from entering the module. The cover also helps to reduce airflow, which further helps to increase the efficiency of the heat sink.
Benefits
The design and build of the ATS-13G-138-C2-R0 Thermal-Heat Sink makes it a great choice for power semiconductor applications. The aluminum construction of the module allows for superior heat conduction, as well as excellent heat dissipation into the surrounding air. The protective cover helps keep dust and debris away from the module, thus promoting better heat management. The design of the heat sink also provides press fit installation, which means it can be installed quickly and easily without consuming a lot of time. This heat sink will improve the longevity of electronic components and reduce the amount of power they consume.
The specific data is subject to PDF, and the above content is for reference