| Allicdata Part #: | ATS22890-ND |
| Manufacturer Part#: |
ATS-13G-14-C2-R0 |
| Price: | $ 4.35 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X20MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13G-14-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.95640 |
| 10 +: | $ 3.85182 |
| 25 +: | $ 3.63787 |
| 50 +: | $ 3.42380 |
| 100 +: | $ 3.20979 |
| 250 +: | $ 2.99580 |
| 500 +: | $ 2.78181 |
| 1000 +: | $ 2.72832 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.97°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-13G-14-C2-R0 is a thermal - heat sink device typically used for cooling electronic systems. Its design combines a finned extruded aluminum body with a pin fin array to provide an efficient heat exchange function. It has a relatively low air flow resistance when compared to traditional heat sinks and provides superior performance at low to medium temperatures. The ATS-13G-14-C2-R0 is a two part construction, with the main body being composed of folded aluminum fins, while the pin fin array is attached to the base aluminum plate.
The main purpose of the ATS-13G-14-C2-R0 is to transfer the heat generated by the electronic components within the system to the surrounding environment. It works by creating a large surface area for the thermal interface material and allowing air to flow through the fins. As the ambient air passes over the flat surface of the fins it is cooled, absorbing the heat created by the electronic components. The increased surface area of the fin array increases the heat transfer rate, allowing the device function more efficiently. Additionally, the structure of the device helps keep the air flow evenly distributed, meaning that the device is able to dissipate heat more uniformly.
The ATS-13G-14-C2-R0 is suitable for a wide range of applications, from basic circuit board cooling to more complex thermal-processing. It’s excellent thermal performance makes it ideal for applications requiring a high level of cooling. It can be used in a wide range of devices including desktop computers, laptop computers, power supplies, computer servers, and communication systems. Additionally, it is particularly suited for automotive applications, as it has a high vibration resistance and good corrosion resistance. The device is also relatively light, making it well suited for mobile applications.
The ATS-13G-14-C2-R0 is easy to install and doesn’t require specialist tools or any other components. In order to install the device, it is necessary to attach the aluminum fins to the base plate. The aluminum fins allow the device to be fitted to standard holes in the PCB without the need to solder or make any other permanent changes. Once fitted, the user needs to ensure that the device is securely attached to the PCB, as the fin array can become detached during operation if not securely fastened.
In conclusion, the ATS-13G-14-C2-R0 is an excellent choice for cooling electronic systems. Its design provides superior thermal performance whilst allowing it to be fitted easily. It’s suitable for a wide range of applications and is durable, making it a great choice for long term use.
The specific data is subject to PDF, and the above content is for reference