ATS-13G-143-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.181" (30.00mm)
Width:	1.181" (30.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.790" (20.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	7.28°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal - Heat Sinks

Heat sinks are vital components in many electronic systems that are designed to regulate the temperature of electrical components and protect them from overheating. In this article, we will focus on the ATS-13G-143-C1-R0 thermal heat sinks, examine its application fields and outline its working principle. The ATS-13G-143-C1-R0 is a high-performance groove heat sink designed for power with DDR3 memory. This type of heat sink is constructed from high quality aluminum alloy material and has excellent thermal conductivity to ensure good heat dissipation. The unique groove design increases the contact area with the surface, meaning that more energy is able to dissipate and the heat continues to move away from the heat source. This type of heat sink is suitable for a range of applications, from cooling CPUs and electronics to communication systems, navigation systems, LED lighting, instrumentation, and medical devices. It also has a range of benefits, such as being lightweight and durable, and is able to withstand extreme temperatures and high vibration. This makes it a suitable choice for high-performance applications. The working principle of the ATS-13G-143-C1-R0 is simple. Heat is absorbed by the heat sink through conduction or convection. The heat is then transferred to the metallic fins of the heat sink, which increases the surface area-to-volume ratio and allows for greater heat transfer and expedited cooling. As the ambient air passes over the fins, the heat is dissipated into the air. The ATS-13G-143-C1-R0 heat sink is a highly efficient heat dissipation device. Its unique design ensures that there is optimal thermal transfer between heat source and air, keeping electronic components cool and protected. Its ability to withstand extreme temperatures and vibrations make it ideal for various applications, from communications systems and instrumentation to LEDs, medical devices, and even power supplies. With its superior heat dissipation capabilities, the ATS-13G-143-C1-R0 is an excellent choice for any system that requires high-performance cooling.

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