ATS-13G-16-C3-R0

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Heat sinks are a type of component typically used in applications requiring efficient thermal management. They are designed to absorb and dissipate heat away from critical components, helping to maintain optimal operating temperatures for components and maximize their performance and longevity. ATS-13G-16-C3-R0 is a thermal - heat sink, designed especially for applications requiring high performance and reliability.

The ATS-13G-16-C3-R0 is a thermally enhanced, all-aluminum construction heat sink. It is designed with a thermal conductivity of 2.3 W/mK and a low thermal resistance of 0.18°C/W. This heat sink features an optimized fin-pitch profile that maximizes the surface area for better heat dissipation. Its dimensions are 40 x 70 x 10.5 mm, making it suitable for a range of thermal management applications.

The ATS-13G-16-C3-R0 also provides excellent strain relief and robustness for demanding environments. An integral cut-out allows it to be easily mounted onto a substrate or other surface, while the anodized finish ensures long-term structural integrity. Its simple and low profile design also reduces the amount of space needed, making it ideal for space-constrained applications.

The ATS-13G-16-C3-R0 is well suitable for a variety of applications such as power supplies, medical and automotive applications, and LED lighting. Its high thermal conductivity, low thermal resistance, and robust construction make it a great choice for any thermal management application. It is also a great choice for high-performance computing applications, as the optimized fin-pitch profile allows for greater heat dissipation, meaning that components such as CPUs and GPUs can stay cooler and perform better.

The ATS-13G-16-C3-R0 is designed with the principles of thermodynamics in mind. Heat is transferred from a warmer to a cooler surface, and it does this by either diffusion, convection, or conduction. Heat sinks use conduction, which is the transfer of thermal energy through direct physical contact between two objects. Heat transfer occurs when a material of higher temperature comes into physical contact with a material of lower temperature, and the ATS-13G-16-C3-R0 is optimally designed to achieve maximum heat transfer.

The ATS-13G-16-C3-R0 is a great choice for any thermal management application. Its high thermal conductivity, low thermal resistance, and robust construction make it ideal for a variety of applications, including power supplies, medical and automotive applications, and LED lighting. Its optimized fin-pitch profile maximizes the surface area for better heat dissipation, making it an ideal choice for high-performance computing applications. And its thermally efficient design and simple installation make it an easy choice for any thermal management application.

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