ATS-13G-166-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS22919-ND

Manufacturer Part#:

ATS-13G-166-C2-R0

Price: $ 3.40
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 25X25X15MM R-TAB T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-13G-166-C2-R0 datasheetATS-13G-166-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 3.08700
10 +: $ 3.00762
25 +: $ 2.92648
50 +: $ 2.76381
100 +: $ 2.60127
250 +: $ 2.43868
500 +: $ 2.35738
1000 +: $ 2.11351
Stock 1000Can Ship Immediately
$ 3.4
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 0.984" (25.00mm)
Width: 0.984" (25.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.590" (15.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 12.18°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is an important consideration in modern electronic devices, and thermal heat sinks are one of the most effective solutions to heat dissipation. The ATS-13G-166-C2-R0 thermal heat sink is a widely applicable AC- to - DC cooling device. It is designed to offer exceptional performance in a wide variety of electronic cooling applications, including devices such as medical and industrial imaging systems, healthcare equipment, medical imaging equipment, imaging systems and laser systems.

The ATS-13G-166-C2-R0 thermal heat sink features a double-layer, high-density fin design optimised for efficient thermal management. The fins are made of aluminium alloy and are designed in such a way that they can effectively dissipate heat from a device or component. The heat sink\'s design also makes it easy to install and remove, reducing installation time and maintenance costs. Moreover, the heat sink\'s fin design helps to prevent air circulation and turbulence, which can further improve its cooling performance.

The ATS- 13G-166-C2-R0 thermal heat sink\'s working principle is based on the principle of thermal radiation. In simple terms, thermal radiation is the transferring of heat from one object to another via electromagnetic radiation. In this case, the heat sink absorbs the heat from the vital components of a device or system, and radiates it away from the source, thus dissipating its heat. The heat sink also helps to reduce the temperature of other components in the device, preventing them from becoming too hot and potentially damaging them.

The ATS-13G-166-C2-R0 thermal heat sink is suitable for a wide range of applications, including medical and industrial imaging systems, healthcare equipment, imaging systems and laser systems. Its versatile design makes it ideal for use in cooling small and large components and provides an effective cooling system for fanless devices. The heat sink can also be used in a variety of other cooling applications, including automotive and aerospace applications, data storage systems and CPUs.

The ATS-13G-166-C2-R0 thermal heat sink is a reliable, efficient and cost-effective cooling solution. Its durable aluminium alloy fins are designed to offer an efficient thermal management solution, while its compact design makes it convenient to install and easy to maintain. Moreover, its versatile design makes it an ideal choice for a wide range of thermal cooling applications.

The specific data is subject to PDF, and the above content is for reference

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