ATS-13G-170-C1-R0

Heat sinks are important components of electronic devices as they help dissipate excess waste heat away from delicate components and maintain an optimal operational temperature. As the demand for electronics with higher power densities continues to rise, more efficient and compact thermal management solutions are becoming increasingly important. One such solution is the ATS-13G-170-C1-R0 heat sink.

ATS-13G-170-C1-R0 Application Field and Working Principle

The ATS-13G-170-C1-R0 is a high-performance heat sink for applications which require rapid and effective thermal management. It is ideally suited for the cooling of LEDs and other small devices which generate large amounts of heat but require small physical footprints. The ATS-13G-170-C1-R0 is a thermally-enhanced aluminum-based alloy heat sink and comes with a black anodized surface finish.

The ATS-13G-170-C1-R0 is a highly efficient heat sink featuring a unique “pin-fin” design. Unlike traditional heat sinks which utilize flat surfaces to disperse heat, this particular model features a series of evenly spaced tubes which act as heat conduction pathways. This ingenious design virtually eliminates hot spots and allow for incredibly efficient heat transfer to the surrounding environment.

In addition to its superior heat transfer capabilities, another advantage of this particular heat sink is its low noise output. Thanks to the “pin-fin” design, air turbulence is significantly reduced which results in much quieter operation than traditional flat-surface heat sinks. The ATS-13G-170-C1-R0 also offers excellent temperature stability and can be easily mounted into various hardware configurations.

Overall, the ATS-13G-170-C1-R0 is a great choice for applications which require highly efficient and reliable thermal management solutions. Its unique “pin-fin” design makes it an ideal choice for LEDs, GPUs, and other small heat sources which generate large amounts of heat but require a small physical footprint.