| Allicdata Part #: | ATS-13G-190-C1-R0-ND |
| Manufacturer Part#: |
ATS-13G-190-C1-R0 |
| Price: | $ 3.77 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13G-190-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.42405 |
| 30 +: | $ 3.23358 |
| 50 +: | $ 3.04340 |
| 100 +: | $ 2.85314 |
| 250 +: | $ 2.66293 |
| 500 +: | $ 2.47272 |
| 1000 +: | $ 2.42517 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.60°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a critical component of any electronic device. Heat is generated in virtually every electronic component, and in order to ensure the optimal performance of the device, the heat generated must be dissipated quickly and efficiently. Heat sinks are components used to dissipate heat away from the critical components of an electronic device. The ATS-13G-190-C1-R0 heat sink is a widely used heat sink that is used for a variety of applications.
The ATS-13G-190-C1-R0 is a high-performance heat sink equipped with a thermal conductive aluminum base. The aluminum base is coated with a black anodized finish to provide optimal heat dissipation. The heat sink also features a wide variety of fins to efficiently dissipate heat away from the surface of the heat sink. The heat generated by the device is transferred to the fins of the ATS-13G-190-C1-R0, and the fins act as radiators to dissipate the heat from the device.
The ATS-13G-190-C1-R0 heat sink is ideal for a variety of applications, and is suitable for a range of environmental conditions. It is designed for use in a variety of electronics, including computers, servers, and other electronic devices. The heat generated by the device is dissipated quickly and efficiently, reducing the chance of device failure. The heat sink also has a wide range of compatibility with a variety of processors, including AMD, Intel, and ARM.
The ATS-13G-190-C1-R0 heat sink is also designed to support multiple wattages, making it suitable for a wide range of applications. The heat dissipated from the device is proportional to the wattage input, so the higher the wattage, the more heat is dissipated. This is beneficial in applications such as servers and computers, where the wattage can vary depending on the workload.
The ATS-13G-190-C1-R0 heat sink is also designed with a wide range of mounting options. It can be mounted in a variety of ways, including direct mounting to the device or using a mounting plate. Direct mounting allows the heat sink to be directly placed onto the device, which is beneficial for applications such as servers, as it eliminates the need for an additional mounting plate.
The ATS-13G-190-C1-R0 heat sink is an ideal thermal management solution for a variety of electronic applications. Its robust design and wide range of compatibility make it suitable for a diverse range of applications. The heat sink is designed for use in a variety of environmental conditions, and its wide range of wattages makes it suitable for a variety of applications. The heat sink is also designed with a wide range of mounting options, allowing it to be used in a variety of applications. Overall, the ATS-13G-190-C1-R0 is an ideal thermal management solution for any electronic device.
The specific data is subject to PDF, and the above content is for reference