| Allicdata Part #: | ATS-13G-199-C3-R0-ND |
| Manufacturer Part#: |
ATS-13G-199-C3-R0 |
| Price: | $ 3.75 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X6MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13G-199-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.41208 |
| 30 +: | $ 3.31968 |
| 50 +: | $ 3.13526 |
| 100 +: | $ 2.95079 |
| 250 +: | $ 2.76641 |
| 500 +: | $ 2.67419 |
| 1000 +: | $ 2.39754 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.236" (6.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.95°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-13G-199-C3-R0 application field and working principle
Heat sinks are components used to increase the surface area of a device, allowing it to dissipate more heat. Generally, heat is dissipated by increasing the surface area of the part making contact with the heat source or environment. The design of the component ensures that no heat is generated within the part itself but is conducted away from the heat source.
Uses of ATS-13G-199-C3-R0 Heat Sinks
The ATS-13G-199-C3-R0 Heat Sink is designed for use in commercial, industrial, and consumer electronics applications. It is a highly efficient heat sink that dissipates heat efficiently and is suitable for applications where high airflow may be necessary, such as cooling of high-powered processors. Additionally, this particular heat sink is designed for passive heatsink applications, meaning it does not require any active cooling or fans to operate.
The ATS-13G-199-C3-R0 Heat Sink is constructed from an aluminum extrusion that is machined into a precise shape allowing for maximum thermal heat transfer. This design also allows for the dissipated heat to be evenly spread across the surface area of the component, resulting in more efficient cooling. The aluminum extrusion also provides thermal conductivity and stability, ensuring that this heat sink can be used in a variety of applications.
Working Principle
The ATS-13G-199-C3-R0 Heat Sink operates by transferring heat from the device being cooled to the surface of the heat sink. This is done through a process of conduction, wherein heat is conducted from the chip to the surface of the heat sink. The heat is then dissipated to the surrounding environment by the process of convection, where air passing through the fins of the heat sink carries the heat away from the surface.
The efficiency of cooling is increased by the design of the ATS-13G-199-C3-R0 Heat Sink. The surface area of the fins has been optimized to maximize the heat transfer from the fins to the air moving through them. Additionally, the fins are angled in such a way that the airflow is directed at the heat source, increasing the rate of heat transfer.
Benefits of ATS-13G-199-C3-R0 Heat Sinks
The ATS-13G-199-C3-R0 Heat Sink provides a number of benefits for commercial, industrial, and consumer applications. The extruded aluminum construction ensures that the component will remain thermally efficient and stable even in extreme temperatures. The design of the fins also helps to ensure that the heat is dissipated efficiently and evenly, resulting in better cooling. Finally, the component is easy to install and requires minimal maintenance, making it an ideal choice for any application where heat dissipation is necessary.
The specific data is subject to PDF, and the above content is for reference