ATS-13G-20-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.126" (54.01mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	7.21°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal - Heat Sink: ATS-13G-20-C3-R0 Application Field and Working Principle

Heat sinking is a thermal management technique used to efficiently dissipate the heat generated by electronic components, such as CPU, memory chips, and power transistors. It is used to keep these components from overheating or burning up. Heat sinks are typically used in combination with fans or other cooling systems to enhance their effectiveness. The ATS-13G-20-C3-R0 model is a type of heat sink designed to provide efficient heat dissipation in a very compact size. The ATS-13G-20-C3-R0 heat sink is a lightweight, low profile device that is highly effective in dissipating heat from electronic components. It is very suitable for applications with limited space available. The ATS-13G-20-C3-R0 heat sink uses a two-stage thermal design that consists of a base plate and a fin stack. The base plate is typically made from aluminum or copper and is designed to provide an effective heat conduction pathway for the fin stack. The fin stack is made from a metal with a greater thermal conductivity than that of the base plate, such as copper. This ensures that the heat generated by the component is quickly and effectively drawn away to the heat sink’s surface and further dissipated into the surrounding air. The ATS-13G-20-C3-R0 heat sink also features an efficient heat spreader to provide additional cooling. This heat spreader is a perforated plate that is mounted atop the fin stack and designed to evenly spread the heat across the entire surface of the heat sink. This ensures that the entire surface of the heat sink is operating at a consistent temperature, maximizing heat dissipation.The ATS-13G-20-C3-R0 heat sink is most commonly used in home computing systems, such as desktops and laptops. It is also commonly used in industrial systems, such as electrical controls and robotics. This is due to its compact size and ability to dissipate heat efficiently.Overall, the ATS-13G-20-C3-R0 heat sink is an effective and efficient solution for dissipating heat from electronic components in a confined space. Its two-stage thermal design ensures that heat is drawn away quickly, and the efficient heat spreader provides a consistent temperature over the whole surface of the heat sink. This makes the ATS-13G-20-C3-R0 an ideal choice for home computing systems, industrial systems, and other applications where efficient heat dissipation is needed.

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