| Allicdata Part #: | ATS-13G-22-C1-R0-ND |
| Manufacturer Part#: |
ATS-13G-22-C1-R0 |
| Price: | $ 4.24 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X12.7MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13G-22-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.81717 |
| 30 +: | $ 3.60507 |
| 50 +: | $ 3.39293 |
| 100 +: | $ 3.18087 |
| 250 +: | $ 2.96881 |
| 500 +: | $ 2.75675 |
| 1000 +: | $ 2.70374 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 13.82°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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.Thermal management is an important tool in the electronics industry. Heat sinks are an ever-important component in keeping electronics cool and optimally functioning. One such heat sink is the Advanced Thermal Solutions (ATS) 13G-22-C1-R0, which plays a vital role in applications ranging from consumer devices to industrial machinery. The ATS 13G-22-C1-R0 has been designed and optimized for improved thermal management of components up to 200 degrees Celsius.
The ATS 13G-22-C1-R0 heat sink consists of a heat spreader and a fin stack. The heat spreader is constructed of extruded aluminum and is designed to ultimately transfer heat from the component to the fin stack. The fin stack is designed to maximize the surface area and quickly dissipate the heat away from the components. In addition, the fin stack is designed to facilitate airflow over the fin stack fins, dissipating heat quickly from the components.
The ATS 13G-22-C1-R0 also benefits from a two-stage cooling system. The first stage is the previously mentioned fin stack, which moves heat away from the components. The second stage is a copper heat plate, which works in tandem with the fin stack. The heat plate couples to the fin stack and acts as an additional radiative cooling source, further dissipating heat away from the component.
Additionally, the ATS 13G-22-C1-R0 can be used with an optional fan for further cooling. This is especially beneficial for applications that may require even further cooling, such as high-power electronics. The fan is installed directly onto the heat sink and is powered through the component itself.
Altogether, the ATS 13G-22-C1-R0 offers improved thermal management for many components operating at temperatures up to 200 degrees Celsius. The combination of the fin stack and heat plate provide excellent thermal dissipation, while the optional fan further enhances cooling capabilities. These features make the ATS 13G-22-C1-R0 an ideal thermal management solution for many applications.
The specific data is subject to PDF, and the above content is for reference