| Allicdata Part #: | ATS-13G-36-C1-R0-ND |
| Manufacturer Part#: |
ATS-13G-36-C1-R0 |
| Price: | $ 5.26 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 36.83X57.6X11.43MM |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13G-36-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.73067 |
| 30 +: | $ 4.46796 |
| 50 +: | $ 4.20512 |
| 100 +: | $ 3.94235 |
| 250 +: | $ 3.67953 |
| 500 +: | $ 3.41671 |
| 1000 +: | $ 3.35100 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.450" (36.83mm) |
| Width: | 2.267" (57.60mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.450" (11.43mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.81°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are a very important component in many electronic and mechanical systems. The purpose of a heat sink is to dissipate heat produced by an electrical or mechanical load, usually by dispersing it into the surrounding air or fluids. ATS-13G-36-C1-R0 is one of the more popular Thermal Heat Sinks designed and manufactured by the industry leader Advanced Thermal Solutions, Inc. (ATS).
The ATS-13G-36-C1-R0 Thermal Heat Sink is constructed from aluminum and features a split design with two rugged fins. This design is ideal for applications involving high heat loads and difficult thermal conditions. Anodized finish makes it resistant to corrosion and environmental damage. It is designed to improve the performance and reliability of a wide range of electronic and mechanical components.
The ATS-13G-36-C1-R0 has an operating temperature range of -55°C to 150°C and a maximum power dissipation rating of 30 W. The thermal interface material used for the ATS-13G-36-C1-R0 is a thermal gap pad, commonly used as a gap filler for applications with large thermal gradients. It provides excellent thermal conductivity and thermal stability. In addition, the pad has a very low thermal resistance, which helps reduce thermal interface resistance and thus improves the overall heat dissipation rate of the ATS-13G-36-C1-R0.
One of the primary advantages of the ATS-13G-36-C1-R0 thermal heat sink is its highly efficient air-cooling capability. The large fin area ensures excellent heat dissipation into the ambient environment. The fins and the inner thermal channels promote excellent airflow and surface contact, allowing the thermal sink to dissipate heat quickly and efficiently.
The working principle of the ATS-13G-36-C1-R0 thermal heat sink is simple. Heat from the source component is dissipated into the fins and channeled away efficiently. The fins then disperse the heat into the surrounding air or fluid. The result is a steady decrease in temperature of the source component and improved overall performance.
The ATS-13G-36-C1-R0 thermal heat sink is an ideal solution for applications where high heat loads are present or difficult thermal conditions exist. It is suitable for use in commercial, industrial, medical, and consumer electronic applications such as computers, data storage, telecommunications, display devices, and other high-power electronic and mechanical systems.
The specific data is subject to PDF, and the above content is for reference