| Allicdata Part #: | ATS-13G-75-C3-R0-ND |
| Manufacturer Part#: |
ATS-13G-75-C3-R0 |
| Price: | $ 3.44 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X20MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13G-75-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.12669 |
| 30 +: | $ 3.04206 |
| 50 +: | $ 2.87305 |
| 100 +: | $ 2.70409 |
| 250 +: | $ 2.53507 |
| 500 +: | $ 2.45056 |
| 1000 +: | $ 2.19705 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.29°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Introduction to ATS-13G-75-C3-R0 Thermal - Heat Sink
The ATS-13G-75-C3-R0 is a thermal - heat sink device designed to dissipate heat away from a processor, memory IC, FPGA, etc. It utilizes a series of pins to form an effective heat transfer surface area for heat dissipation and conduction. The device is designed to maintain a steady and efficient operating temperature within a specified range of temperatures. This allows the device to function optimally under varying operating temperatures and environmental conditions.
Applications of ATS-13G-75-C3-R0 Thermal - Heat Sink
The ATS-13G-75-C3-R0 thermal - heat sink is well-suited for a large variety of applications where superior heat dissipation is required. This includes electronics systems such as computers, home and office electronics, and industrial equipment. It can be used for applications such as cooling computer processors, cooling laptop and notebook CPUs, cooling system boards, and cooling memory ICs and FPGAs, among many other types of electronics.
Working Principle of ATS-13G-75-C3-R0 Thermal - Heat Sink
The ATS-13G-75-C3-R0 thermal - heat sink works by transferring heat away from the source component. This is achieved by using a series of thin pins on the heat sink’s surface that act as a heat transfer surface. As the heat travels away from the component, it is dissipated into the air around the device. The thermal - heat sink design is optimized to ensure that the dissipated heat does not significantly increase the temperature of the surrounding air. This ensures that the device maintains an optimal operating temperature even under varying environmental conditions.
The ATS-13G-75-C3-R0 thermal - heat sink also features a number of advanced design features such as heat fin pins, black chrome finish, and an optimized heat fin pattern. These features ensure that the heat sink offers an improved heat dissipation performance and superior reliability. The device is designed to be easy to install and compatible with a wide range of components including processors, memory ICs, FPGAs, and more.
Conclusion
The ATS-13G-75-C3-R0 thermal - heat sink is a reliable yet powerful heat dissipation device. It is well-suited for a wide variety of applications that require superior heat dissipation performance. The device is designed to maintain an optimal operating temperature, ensuring that the device performs optimally no matter what environment it is operating in. The device is also easy to install and compatible with a variety of components, making it a great choice for various electronics systems.
The specific data is subject to PDF, and the above content is for reference