ATS-13G-90-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-13G-90-C1-R0-ND

Manufacturer Part#:

ATS-13G-90-C1-R0

Price: $ 3.94
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 35X35X35MM R-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-13G-90-C1-R0 datasheetATS-13G-90-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.58596
30 +: $ 3.38646
50 +: $ 3.18730
100 +: $ 2.98809
250 +: $ 2.78888
500 +: $ 2.58968
1000 +: $ 2.53987
Stock 1000Can Ship Immediately
$ 3.94
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.378" (35.00mm)
Width: 1.378" (35.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.378" (35.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 6.33°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Thermal - Heat Sinks

ATS-13G-90-C1-R0 is a thermal-heat sink that is used in electronics and process control systems. It is designed to control the temperature of electronic components and circuits in order to prevent damage from overheating. The thermal-heat sink works by transferring heat away from the component and into the environment.

The ATS-13G-90-C1-R0 is made up of two main components: the base and the fins. The base is usually constructed out of aluminum or copper, and allows the heat to be dissipated from the component or circuit. The fins are designed to efficiently transfer heat away from the base into the atmosphere. They are usually made out of aluminum or copper and are often conically shaped to help encourage efficient heat transfer.

The working principle of a ATS-13G-90-C1-R0 is simple, but effective. A thermal interface material is applied to the underside of the base. This creates a contact point between the component or circuit and the base, so as to allow the heat generated by the component or circuit to transfer directly to the base. Heat is then efficiently transferred from the base into the fins where it is eventually dissipated into the atmosphere. This process enables the heat generated by the component to be removed from the system, thus keeping the component from overheating.

ATS-13G-90-C1-R0 is commonly used in a variety of applications including consumer electronics, automotive applications, and process control systems. In consumer electronics, it is used to keep delicate and sensitive circuits from overheating due to overuse. It can also be used to keep motors and other heat generating components in vehicles from overheating. In process control systems, it is used to regulate temperatures in order to maintain proper performance.

Heat sinks are an important component in any system that involves electronic components. They play a vital role in helping to maintain temperatures and prevent components from becoming overheated. The ATS-13G-90-C1-R0 is a reliable and efficient thermal-heat sink that is widely used in a variety of applications.

The specific data is subject to PDF, and the above content is for reference

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