| Allicdata Part #: | ATS-13H-117-C1-R0-ND |
| Manufacturer Part#: |
ATS-13H-117-C1-R0 |
| Price: | $ 3.09 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13H-117-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.78208 |
| 30 +: | $ 2.70669 |
| 50 +: | $ 2.55629 |
| 100 +: | $ 2.40591 |
| 250 +: | $ 2.25553 |
| 500 +: | $ 2.18034 |
| 1000 +: | $ 1.95479 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.46°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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A thermal-heat sink is a device designed to allow heat to escape from an enclosed space, usually in a computer system. The ATS-13H-117-C1-R0 is a very versatile model of thermal heat sink designed to meet thermal needs for computer systems. This type of heat sink is used to reduce the temperature of the processor by dissipating heat away from the hottest parts of the system.
The ATS-13H-117-C1-R0 is designed with two fins to help achieve an efficient level of thermal management. These fins are positioned to provide maximum heat transfer. The fins are constructed from high-grade extruded plastic and aluminum, making them resistant to thermal fatigue. The fins are then bonded to the body of the heat sink using mechanical fasteners. This ensures that the heat sink remains securely attached to the processor.
In addition to the heat sink\'s fins, the device also features a wide range of cooling solutions. It utilizes a combination of air, liquid, and thermoelectric cooling technologies to maintain a consistent level of heat transfer. The combination of these cooling technologies allows the ATS-13H-117-C1-R0 to dissipate heat more efficiently than other models of thermal heat sinks.
The ATS-13H-117-C1-R0 also offers other features to maximize its cooling capability. It has an integrated fan to help improve airflow. It also has three adjustable fan speed settings to further regulate the amount of heat dissipated. It is also designed with a quick and easy installation process, so that it can be added to any computer system without having to disassemble the entire system.
The ATS-13H-117-C1-R0 is designed to meet the technical requirements of today\'s computer systems. It has a die-cast aluminum body that ensures a stable frame, allowing the device to take on more demanding thermal loads. The heat sink also has an optimized fin design to maximize the heat transfer capability. The device also includes a range of mounting options, making it suitable for a wide range of applications.
The ATS-13H-117-C1-R0 is designed to efficiently remove heat from computer systems by transferring the heat away from the hottest parts of the system. It does this by using the combination of air, liquid, and thermoelectric cooling technologies to maintain a consistent level of heat transfer. The heat sink is designed with adjustable fan speeds, enabling users to regulate the amount of heat dissipated. It also offers an advanced design with a die-cast aluminum frame and optimized fins, allowing it to handle more demanding thermal loads and take on a variety of applications.
The specific data is subject to PDF, and the above content is for reference