| Allicdata Part #: | ATS-13H-12-C1-R0-ND |
| Manufacturer Part#: |
ATS-13H-12-C1-R0 |
| Price: | $ 3.48 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X12.7MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13H-12-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.16197 |
| 30 +: | $ 3.07671 |
| 50 +: | $ 2.90581 |
| 100 +: | $ 2.73489 |
| 250 +: | $ 2.56397 |
| 500 +: | $ 2.47851 |
| 1000 +: | $ 2.22211 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.84°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important consideration in many electronic applications. This is especially true of those that involve high power and high operating temperatures. The ATS-13H-12-C1-R0 thermal heat sink is designed to address these conditions and provide superior thermal management capabilities for electronic components.
A thermal heat sink is a device designed to conduct away heat generated by an electronic component. The ATS-13H-12-C1-R0 is a specially engineered aluminum finned heat sink designed for maximum efficiency. The fins of the heat sink are engineered to present a larger surface area which allows air to circulate around the component, carrying heat away and dissipating it efficiently.
The ATS-13H-12-C1-R0 heat sink features an advanced anodized aluminum surface which provides superior thermal efficiency compared to standard aluminum heat sinks. It also features a thermally conductive ceramic interface to provide maximum heat transfer from the component to the heat sink. In addition, the ATS-13H-12-C1-R0 is designed to be used with a range of cooling fans, providing flexibility in designing thermally managed systems.
When selecting a thermal heat sink for your electronic application, there are several factors to consider. The ATS-13H-12-C1-R0 is designed to be used in power systems up to 350 watts, providing effective thermal management for a wide range of applications. The heat sink is also designed to optimize air circulation, providing efficient heat dissipation. The unique fin design of the ATS-13H-12-C1-R0 disperses heat more efficiently than non-finned heat sinks, improving system performance and reliability.
The ATS-13H-12-C1-R0 is designed to provide superior thermal management performance. Its anodized aluminum surface is up to three times more thermally efficient than standard aluminum sinks. The patented fin design further increases the performance of the heat sink, reducing temperatures up to 40%. The use of the ceramic interface allows for improved heat transfer from the component to the heat sink, while the potential for variable fan speeds allows for flexibility in system design and cooling capacity.
The ATS-13H-12-C1-R0 is designed for use in industrial, automotive, medical, and other electronic applications. It has the capability to be used in a wide range of power systems, providing effective thermal management in even the most challenging environments. Its superior thermal performance and flexibility make it an ideal solution for thermal management in a wide range of applications.
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