ATS-13H-120-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-13H-120-C1-R0-ND

Manufacturer Part#:

ATS-13H-120-C1-R0

Price: $ 3.37
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X25MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-13H-120-C1-R0 datasheetATS-13H-120-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.06684
30 +: $ 2.98431
50 +: $ 2.81849
100 +: $ 2.65268
250 +: $ 2.48686
500 +: $ 2.40397
1000 +: $ 2.15528
Stock 1000Can Ship Immediately
$ 3.37
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 3.45°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks are devices that help dissipate heat generated by components in a given environment, ensuring reliability and performance. The ATS-13H-120-C1-R0 heat sink is designed for high-performance thermal management. This product is optimized to improve performance and reduce power and cooling costs.

The ATS-13H-120-C1-R0 heat sink is designed for direct thermal energy transfer between components and their surroundings. The product is a natural convection type that uses heat pipes, fans, or both to transfer heat away from the component. With its optimized design, this heat sink effectively dissipates heat from components, allowing them to operate at their optimum performance.

The ATS-13H-120-C1-R0 heat sink is constructed with aluminum for thermal conductivity. The product also comes with fans, aluminum fins, and heat-pipe technology that further improve the effectiveness of the heat sink. In addition, it has an optimized fin profile that offers better air circulation, allowing for a more efficient cooling system. It also utilizes an extruded structure for maximum strength and a lightweight design.

This heat sink is suitable for applications in telecommunications, medical, computer, data centers, and many other industries. It is an ideal solution for cooling high-performance electronics and components, ensuring maximum performance and stability. The product is also suitable for high-temperature environments where components need to be kept at optimum operating temperatures.

The ATS-13H-120-C1-R0 heat sink is designed to work with a wide variety of thermal solutions. These solutions include heat-pipe cooling systems, chilled water systems, evaporative coolers, and air-to-air exchangers. This product is also compatible with most application-specific cooling systems, including computer, telecommunications, and industrial applications.

The product is also designed with an easy-to-install design that allows for quick and easy installation in a wide variety of applications. It also has an adjustable mounting bar to ensure a secure fit and a flexible fan configuration to maximize cooling performance. For additional protection, the product is equipped with high-quality rubber corners and integrated rivet mounting.

The ATS-13H-120-C1-R0 heat sink is designed with advanced technology for improved thermal performance and energy savings. It is a high-performance, versatile product that works with various types of cooling solutions and is suitable for a wide range of applications. By utilizing this product, companies can enjoy improved efficiency, increased reliability, and reduced power and cooling costs.

The specific data is subject to PDF, and the above content is for reference

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