ATS-13H-131-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.362" (60.00mm)
Width:	2.362" (60.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.790" (20.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	3.65°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction:

Thermal-heat sinks are used to dissipate heat away from sensitive components, and are often an integral part of an overall system to prevent excessive heating and damage to the component. ATS-13H-131-C3-R0 is a type of heat sink, specifically designed for use with small, circular components, in order to keep them within their specified temperature ranges.

ATS-13H-131-C3-R0 Application Field:

ATS-13H-131-C3-R0 is most commonly used for dissipating heat away from small and circular components such as integrated circuit chips, capacitors, and other electronic components, which generate a substantial amount of heat during operation. It is used to keep these components from exceeding their specified temperature ranges, in order to prevent damage to them. It is also used to cool down and protect components that are sensitive to high temperatures.

ATS-13H-131-C3-R0 Working Principle:

The ATS-13H-131-C3-R0 is a type of thermal transfer device, which works on the principle of thermoelectricity. It consists of a series of metal plates which are spaced out such that air is allowed to pass between them in order to cool the component or structure it is attached to. When a current passes through these metal plates, the heat is transferred from the heated component to the plates and then dissipated away with the expelled air, thus cooling the component.The advantage of this particular thermal transfer device is that it is able to dissipate heat away more quickly than other types of heat sinks. As a result, it can keep components from reaching their temperature limits more quickly and efficiently. It is also more reliable and safer since it dissipates the heat away without requiring a fan, which could potentially create excess noise and/or cause additional damage.

Conclusion:

The ATS-13H-131-C3-R0 is an effective and efficient thermal transfer device that is specially designed to keep small and circular components from exceeding their specify temperature ranges. It works on the principle of thermoelectricity, which allows for effective and efficient cooling of the components. It is a reliable and safe device, making it a great choice for dissipating heat away from sensitive components.

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