| Allicdata Part #: | ATS-13H-135-C1-R0-ND |
| Manufacturer Part#: |
ATS-13H-135-C1-R0 |
| Price: | $ 6.04 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X20MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13H-135-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.43627 |
| 30 +: | $ 5.13429 |
| 50 +: | $ 4.83235 |
| 100 +: | $ 4.53033 |
| 250 +: | $ 4.22831 |
| 500 +: | $ 3.92629 |
| 1000 +: | $ 3.85078 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.99°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are essential components in the field of electrical and electronic systems. In electronic systems, high temperatures produced by components can cause component failure and performance degradation. Heat sinks can protect electronic components from becoming overheated, thereby increasing system reliability and performance. ATS-13H-135-C1-R0 is an advanced thermal management solution that is specifically designed to control and dissipate the heat generated by electronic components.
The ATS-13H-135-C1-R0 Thermal – Heat Sink consists of a high efficiency aluminum base with an embossed pattern, providing maximum surface area for the efficient dissipation of heat. The heat sink is attached to a thermally conductive bracket, allowing for efficient heat transfer. In addition, the finned structure of the unit is designed to promote greater airflow and further reduce system temperatures.
The ATS-13H-135-C1-R0 Heat Sink utilizes a thermoelectric principle to control and dissipate the heat generated by electronic components. When operating, the thermal element is energized and heat is transferred from the component to the heat sink through the thermoelectric effect. This process results in a significant reduction in the operating temperature of the component, allowing for an enhanced system performance and reducing the likelihood of system or component failure.
A number of applications can benefit from the ATS-13H-135-C1-R0 Thermal – Heat Sink, including power conversion, power protection, and audio and video processing equipment. In power conversion, the heat sink is used to protect power converters from overheating and ensure their reliable operation. For power protection, the heat sink helps reduce the temperature of protected components and help prevent them from overheating. In audio and video processing equipment, the heat sink can help dissipate the heat generated by the high-powered components, such as amplifiers, processors, and power supplies, while also protecting the internal components from damage due to excessive heat.
The ATS-13H-135-C1-R0 Thermal – Heat Sink is reliable and efficient, ensuring an improved performance and increased system reliability. It is a cost-effective solution for controlling and dissipating the heat generated by electronic components, helping to improve system performance and reliability while keeping system costs to a minimum.
The specific data is subject to PDF, and the above content is for reference