| Allicdata Part #: | ATS-13H-136-C3-R0-ND |
| Manufacturer Part#: |
ATS-13H-136-C3-R0 |
| Price: | $ 7.19 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13H-136-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 6.46695 |
| 30 +: | $ 6.08664 |
| 50 +: | $ 5.70629 |
| 100 +: | $ 5.32589 |
| 250 +: | $ 4.94545 |
| 500 +: | $ 4.85034 |
| 1000 +: | $ 4.75524 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.22°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are a type of mechanical cooling system that uses radiating fins, vanes, and other metal components to absorb and disperse heat away from a device\'s heat-generating components. The ATS-13H-136-C3-R0 is a type of thermal-heat sink that is specifically designed for high-power, high-heat applications. By using this device, an end-user can reduce the amount of wasted energy and improve the longevity of their electronic device.
The ATS-13H-136-C3-R0 was designed with a three-stage cooling process. First, the thermal-heat sink is used to absorb the heat. As the heat is absorbed, it is transferred through the fins into the outer edge of the device where it is dissipated to the environment or other objects. This maintains a stable temperature range for the device. The second stage is to reduce the speed of conduction to prevent the breaking down of microelectronics due to the excessive heat.
The third stage of cooling is where the thermal-heat sink really shines. By using fins to create a much larger surface area that is exposed to air, the ATS-13H-136-C3-R0 can efficiently reduce and maintain a temperature range that is suitable for the application. This allows the device to remain cool enough for optimal operation without generating too much heat.
The ATS-13H-136-C3-R0 can be used for a variety of applications. In most cases, it is used to reduce the heat created by electrical components in devices such as computers and power supplies. In addition, it can also be used in other applications such as industrial machines, high-powered communications devices, and medical equipment.
Aside from its application field, the ATS-13H-136-C3-R0 also has a couple of great features that make it an ideal choice for thermal management. First, its components are made from aluminum, copper, and other alloys to ensure excellent heat transfer properties. Additionally, its design utilizes a series of louvers and diffused channels that direct and optimize the airflow, allowing for a greater cooling efficiency.
In conclusion, the ATS-13H-136-C3-R0 is a great choice for applications that require a thermal-heat sink that can efficiently transfer and dissipate heat away from sensitive components. Its three-stage cooling process enables it to reduce the temperature of components to an optimal level, while its design ensures a greater cooling efficiency. Overall, the ATS-13H-136-C3-R0 is an excellent choice for thermal management.
The specific data is subject to PDF, and the above content is for reference