ATS-13H-14-C2-R0

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Introduction

ATS-13H-14-C2-R0 thermal heat sink is a widely-used type of heat sink designed for high-temperature applications. It is designed for superior performance, reliability, and durability, with an improved thermal resistance rating. This heat sink also advantages in higher heatsink surface area, low thermal resistance, good heat dissipation, and has an excellent performance to cost ratio.

Application Field

The ATS-13H-14-C2-R0 heat sink is widely used in many electronics, including computers, telecommunications, audio/video equipment, consumer products, medical equipment, telephones, instrumentation, optical equipment, and more. It can be used in a variety of consumer and commercial industries, in data centers, offices, warehouses, and factories.

This heat sink has a number of features that make it attractive for various applications in these industries. It can provide good thermal stability and better heat dissipation than other thermal solutions. It is also highly efficient in dissipating heat and ensuring the long-term performance and durability of the electronics.

The ATS-13H-14-C2-R0 is also suitable to use in other electronic components. It can be used in power supplies, and LED lighting applications. It is designed for high-temperature applications and can provide excellent thermal performance for the device.

Working Principle

The ATS-13H-14-C2-R0 thermal heat sink is designed to dissipate heat from the electronic device or component that it is mounted on. It works on the principle of heat conduction. The heat generated by the device is conducted away from the component and dissipated into the air. The heat sink is fitted with a number of fins that provide additional surface area so the heat can be dissipated more efficiently.

The heat sink’s fin arrangement also ensures that the maximum amount of surface area is exposed to the air, providing better heat dissipation. The heat dissipates from the device and is cooled by the air passing over the fins. This allows the device to operate at a lower temperature, improving its performance and preventing it from overheating.

The ATS-13H-14-C2-R0 also has a heat conductive coating which increases the heat conductivity of the heat sink. This is beneficial when dealing with high-power components and devices that generate high levels of heat. The coating ensures that the heat is dissipated efficiently and reaches the outer fins where it can be dissipated.

Conclusion

The ATS-13H-14-C2-R0 is a high-performance thermal heat sink that offers excellent thermal performance and superior heat dissipation. It has a highly efficient fin arrangement, allowing for maximum surface area exposure and better heat dissipation. It also features a heat conductive coating which increases its heat conductivity and provides better performance even in high-temperature environments. This makes it a great choice for a variety of electronics, as well as lighting and power applications.

The specific data is subject to PDF, and the above content is for reference