ATS-13H-153-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-13H-153-C3-R0-ND

Manufacturer Part#:

ATS-13H-153-C3-R0

Price: $ 3.91
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X10MM L-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-13H-153-C3-R0 datasheetATS-13H-153-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.55131
30 +: $ 3.35370
50 +: $ 3.15643
100 +: $ 2.95917
250 +: $ 2.76189
500 +: $ 2.56462
1000 +: $ 2.51530
Stock 1000Can Ship Immediately
$ 3.91
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 12.06°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

ATS-13H-153-C3-R0 application field and working principle

As one of the leading components of the thermal management industry, ATS-13H-153-C3-R0 heat sinks have been widely used in various fields. It is recognized as one of the most efficient and advanced thermal management solution available on the market. The application of ATS-13H-153-C3-R0 heat sinks is mainly divided into two fields, which are consumer electronics and industrial applications.

Consumer Electronics

ATS-13H-153-C3-R0 heat sinks are usually used in consumer electronic devices and appliances such as notebooks, desktops, computers, televisions, tablets, etc. It is designed to efficiently dissipate heat from the components to keep the device working at its optimum temperature. The heat sink is usually placed on top of the device so that it can absorb the heat energy radiating from the device. It also helps to protect the device from overheating.

Industrial Applications

ATS-13H-153-C3-R0 heat sinks are also used in many industrial applications, such as electronic circuit boards, power supplies, LED lights, lasers, and many other electronic devices. The heat sink helps to distribute the heat produced by the device components evenly. This ensures that the device works at optimal temperature and performance. The heat sink also helps to reduce stress on the components, prolonging the device’s life.

Working Principle

The working principle of ATS-13H-153-C3-R0 heat sinks is to absorb the heat energy from the device components and to dissipate it into the atmosphere. This process helps to reduce the temperature of the device, optimizing its performance and longevity. The heat sinks are usually made up of metal alloys, which are highly efficient at dissipating heat energy into the atmosphere.

The heat sink consists of a base material, such as aluminum or copper, which is thermally conductive. The heat sink also has a finned structure which provides a large surface area for heat energy to be absorbed from the device components. The heat energy is then conducted away from the base material and into the atmosphere. This process ensures that the device works at its best temperature, thus improving its performance and longevity.

Conclusion

In conclusion, ATS-13H-153-C3-R0 heat sinks are an effective solution for both consumer electronics and industrial applications. The heat sinks are made up of high-grade metal alloys which efficiently dissipate heat energy into the atmosphere. This helps to reduce the temperature of the device and optimize its performance and longevity. The heat sink also has a finned structure which provides a large surface area for heat energy to be absorbed from the device components and efficiently conducted away.

The specific data is subject to PDF, and the above content is for reference

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