ATS-13H-160-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-13H-160-C3-R0-ND

Manufacturer Part#:

ATS-13H-160-C3-R0

Price: $ 4.32
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X15MM L-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-13H-160-C3-R0 datasheetATS-13H-160-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.88647
30 +: $ 3.67059
50 +: $ 3.45467
100 +: $ 3.23870
250 +: $ 3.02279
500 +: $ 2.80687
1000 +: $ 2.75290
Stock 1000Can Ship Immediately
$ 4.32
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.590" (15.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 6.75°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

A thermal-heat sink is a device that dissipates heat generated by electronic components into the air or liquid. Heat sinks are commonly used for cooling electronic devices such as processors, voltage regulators, and power modules. The ATS-13H-160-C3-R0 is a type of thermal-heat sink that is capable of dissipating large amounts of heat from electronic devices.

The ATS-13H-160-C3-R0 consists of an insulated sheet metal stamping that is designed to form a finned heat sink base. The base is attached to an aluminum frame and equipped with four aluminum finned heat sink assemblies, each connected to a copper heat pipe conductor. The fins are also designed to maximize the surface area to improve heat dissipation from the electronic components. The heat pipe conductors are filled with a refrigerant, such as liquid nitrogen, to absorb and dissipate the heat from the electronic components in the form of a vapor. This vapor then condenses on the fins, transferring the heat to the environment.

The ATS-13H-160-C3-R0 thermal-heat sink is capable of dissipating large amounts of heat through high performance convection cooling. It has a specification of 160 watts at peak load and can dissipate up to 135 watts of heat. This makes it well suited for applications in which large amounts of heat need to be dissipated, such as in high-power electronics. The ATS-13H-160-C3-R0 can also be used as an active cooling system when powered by an external fan, providing enhanced cooling performance for more demanding applications.

The ATS-13H-160-C3-R0 is frequently used in applications such as LED lighting, power supplies, bluetooth headsets, computers, and medical imaging systems. Additionally, it is often used in industrial environments such as factories and data centers. These applications require reliable cooling solutions to keep the temperature of the components within the correct range and prevent potential problems such as overheating. The ATS-13H-160-C3-R0 is a reliable and effective cooling solution for these types of applications.

The ATS-13H-160-C3-R0 is an efficient and reliable way to dissipate heat from electronic components. Its construction is designed to allow for efficient transfer of heat from the components into the environment, ensuring that they operate reliably and at optimal temperatures, even in harsh conditions. The ATS-13H-160-C3-R0 thermal-heat sink is an effective solution for applications requiring efficient and reliable cooling solutions.

The specific data is subject to PDF, and the above content is for reference

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