| Allicdata Part #: | ATS23141-ND |
| Manufacturer Part#: |
ATS-13H-188-C2-R0 |
| Price: | $ 4.60 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X15MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13H-188-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.18320 |
| 10 +: | $ 4.07169 |
| 25 +: | $ 3.84527 |
| 50 +: | $ 3.61910 |
| 100 +: | $ 3.39293 |
| 250 +: | $ 3.16673 |
| 500 +: | $ 2.94054 |
| 1000 +: | $ 2.88399 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.67°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks - ATS-13H-188-C2-R0 Application Field and Working Principle
A thermal heat sink is an essential device for helping to dissipate the excess energy generated by electronic components during their operation. In order for these components to operate safely and efficiently, it is important to keep them running at a safe temperature. The ATS-13H-188-C2-R0 heat sink, a magnalium and zinc-alloyed metal sink with an enhanced thermal conductivity, is one of the most popular solutions for this purpose.
The ATS-13H-188-C2-R0 heat sink is designed to efficiently transfer heat away from the source, improving the performance and safety of an electronic component. It is a combination of zinc and copper materials, cut in layers to create a composite structure. This composite structure is effective at absorbing and transferring thermal energy due to its lower thermal mass and higher thermal conductivity. The lower thermal mass of the ATS-13H-188-C2-R0 also helps prevent overheating, as it absorbs less of the heat generated by the component and removes it away from the source quickly.
The ATS-13H-188-C2-R0 heat sinks come in a variety of sizes, shapes, and styles, allowing for an appropriate solution for any application. One of the most significant advantages of using a heat sink in an electronic application is its ability to dissipate the heat generated by the device in a consistent and reliable manner. Inherently, zinc and copper are both good thermal conductors, ensuring that heat is effectively removed from the source and dispersed in the ambient air.
The thermal insulation of a zinc and copper alloyed ATS-13H-188-C2-R0 heat sink is particularly effective in electronics. In order to best ensure that the thermal insulation is effective, manufacturers usually design the heat sink using fins at the base of the sink. These fins help the heat sink to take up the most heat it can, leading to improved performance in the circuit board that is powered by the device.
The ATS-13H-188-C2-R0 heat sink is an effective solution for any electronic component. It is designed to spread the heat evenly and quickly, allowing electronic components to operate safely and optimally. In addition, the fins on the bottom of the heat sink help to absorb more of the heat generated by the component, helping to increase the overall efficiency and performance of the circuit board.
The ATS-13H-188-C2-R0 heat sink is an efficient and cost-effective solution for thermal management. Its combination of zinc and copper materials ensures that any heat generated by the component is dispersed efficiently into the ambient air. In addition, its fins help to keep the operating temperature of the component consistent, ensuring that it can continue to operate safely and optimally.
The specific data is subject to PDF, and the above content is for reference