ATS-13H-193-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.575" (40.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.236" (6.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	21.29°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction to Thermal - Heat Sinks

Thermal - Heat Sinks are a cooling mechanism used in many electronic components and systems. They are used to dissipate heat generated by a device or system, and are typically made from metal or plastic. Many Thermal - Heat Sinks are designed to fit onto the component or system that is generating heat, and can be placed in a variety of positions. Heat sinks are most often used in situations where a cooling system is not sufficient, or in areas where the environment is hot and humid.

ATS-13H-193-C3-R0 Application Field

The ATS-13H-193-C3-R0 is a high quality Thermal - Heat Sink designed and manufactured by Actron Corporation. It is designed to dissipate thermal energy efficiently from a wide range of components and systems, including computers, servers, industrial equipment, lighting fixtures, and other hot spots. The ATS-13H-193-C3-R0 is built with durable yet lightweight aluminum and has a corrosion resistant finish. The size of the ATS-13H-193-C3-R0 Heat Sink is 1.93” tall, 1.3” wide, and 0.3” thick. The heat sink can be use in areas with temperatures up to 120°F (48.9°C). Other features of the ATS-13H-193-C3-R0 include a thermally conductive mounting plate, a built-in fan, multiple mounting hole options, and a mounting clamp.

ATS-13H-193-C3-R0 Working Principle

The ATS-13H-193-C3-R0 is a Thermal - Heat Sink that works by dissipating heat generated by the component or system onto which it is mounted. The heat is transferred through the mounting plate of the ATS-13H-193-C3-R0 to the heat sink itself, which then dissipates the heat to the environment. The mounting plate is specifically designed to have an extremely high thermal conductivity, allowing for efficient heat transfer.The ATS-13H-193-C3-R0 also incorporates a built-in fan to actively cool the heat sink when needed. The fan is able to run at various speeds, from low to high, to ensure the heat sink is able to meet the cooling demands of the component or system it is mounted onto. The ATS-13H-193-C3-R0 is designed to be easily installed onto the component or system. It is easily adjustable, allowing it to be placed in various positions depending on the orientation of the component or system. It also includes multiple mounting hole options, making it tailored for various installations.

Conclusion

The ATS-13H-193-C3-R0 is a high performance Thermal - Heat Sink designed and manufactured by Actron Corporation. It is designed to be easily installed onto a wide range of components and systems, and dissipates thermal energy efficiently using its durable yet lightweight aluminum construction, thermally conductive mounting plate, and built-in fan. The ATS-13H-193-C3-R0 is a reliable and cost-effective solution for dissipating heat from hot spots in any environment.

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