
Allicdata Part #: | ATS-13H-20-C1-R0-ND |
Manufacturer Part#: |
ATS-13H-20-C1-R0 |
Price: | $ 3.99 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 54X54X25MM XCUT |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 3.62061 |
30 +: | $ 3.41922 |
50 +: | $ 3.21817 |
100 +: | $ 3.01701 |
250 +: | $ 2.81588 |
500 +: | $ 2.61474 |
1000 +: | $ 2.56446 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 2.126" (54.01mm) |
Width: | 1.575" (40.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.984" (25.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 7.13°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
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.Thermal management is a key component of electronic systems and components in order to ensure efficient, reliable operation. As such, the development of thermal-related components such as heat sinks is crucial to maintaining proper system performance. The ATS-13H-20-C1-R0 is a type of heat sink application that is used in various electronic devices. This article will discuss the application fields and working principles of the ATS-13H-20-C1-R0 heat sink.
Application Fields of ATS-13H-20-C1-R0 Heat Sink
The ATS-13H-20-C1-R0 heat sink is a widely used thermal management component in high-power electronics, due to its ability to efficiently dissipate heat away from hot components. It can be used in a variety of devices, including industrial computers, power-converters, data centers, solar cells, and more. Its low-profile design and ability to dissipate heat at a low-noise level makes it ideal for both industrial and commercial applications. It is also often used in consumer-grade electronics such as televisions, game consoles, and computers.
Working Principle of ATS-13H-20-C1-R0 Heat Sink
The ATS-13H-20-C1-R0 heat sink uses several thermally-conductive aluminum fins to dissipate heat away from the hot components, and its design also ensures airflow over the fins for more efficient heat dissipation. The fins are designed to be arranged in an array, allowing for a larger surface area and greater heat dissipation. The heatsink also features a large base plate, which ensures better heat transfer from the components to the fins and provides more stability.
In addition, the ATS-13H-20-C1-R0 heatsink has a clip-on fan attachment, which allows for forced air cooling. This increases the dissipation rate of the heat sink, allowing for a more efficient thermal management of the device. Furthermore, the heatsink can be used with various liquid-cooling solutions as well, giving users more options when it comes to thermal management.
The ATS-13H-20-C1-R0 heat sink is a versatile and reliable thermal solution for a wide variety of applications. Its efficient design and ability to be used in combination with other cooling solutions make it an ideal choice for high-power electronics.
To conclude, the ATS-13H-20-C1-R0 heat sink is a reliable and efficient thermal management component for various electronics. With its efficient design and ability to be used with other cooling solutions, it is an ideal choice for keeping hot components cool.
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