| Allicdata Part #: | ATS-13H-208-C3-R0-ND |
| Manufacturer Part#: |
ATS-13H-208-C3-R0 |
| Price: | $ 6.24 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X6MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13H-208-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.61015 |
| 30 +: | $ 5.29830 |
| 50 +: | $ 4.98658 |
| 100 +: | $ 4.67492 |
| 250 +: | $ 4.36325 |
| 500 +: | $ 4.05159 |
| 1000 +: | $ 3.97368 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.236" (6.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.56°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Introduction to ATS-13H-208-C3-R0 Thermal - Heat Sink.
The ATS-13H-208-C3-R0 is a type of thermal-heat sink primarily used to dissipate heat away from a specified area. This type of thermal-heat sink is commonly used in many electronic and electrical applications. This article will discuss the application fields and working principles of the ATS-13H-208-C3-R0 thermal-heat sink.
Application Fields
The ATS-13H-208-C3-R0 thermal-heat sink can be used in a variety of applications. It is commonly used in the manufacturing of computers, embedded systems, electronic circuits, and communication equipment. It is also used for cooling electronic components, such as CPUs, GPUs, ASICs, RAMs, and peripherals. This type of heat sink can also be used to dissipate heat away from power converters, DC-DC converters, AC-DC converters, and other power electronics.
In addition, this thermal-heat sink is also used in the automotive industry to cool down diesel engines, transmissions, and automatic transmission fluid. It can also be used in the medical industry for cooling medical equipment, such as X-ray machines and MRI scanners.
Working Principle
The ATS-13H-208-C3-R0 thermal-heat sink works by using the principle of thermodynamics. As heat is generated by a component or device, it is dissipated by the thermally-conductive properties of the heat sink. The heat sink works by dissipating the heat energy away from the source, which in turn reduces the temperature of the component or device. This is done by transferring the thermal energy away from the source into the environment.
The heat sink is generally made up of a base, which is thermally-conductive to allow efficient heat transfer from the source to the heat sink. This base is usually made up of an aluminum or copper alloy. The base is then covered with a series of fins to improve the surface area of the heat sink, providing more area for the heat transfer. The thermal energy is then dissipated into the environment by natural convection.
The shape of the fins and the type of material used in the fins vary depending on the application of the thermal-heat sink. The fins are designed to maximize the surface area for heat dissipation and to provide the correct amount of air circulation for proper cooling. The fins are also designed to reduce turbulence which would otherwise reduce the efficiency of the heat dissipation.
The ATS-13H-208-C3-R0 is a high-performance thermal-heat sink which can provide effective heat dissipation and cooling for a range of electronic and electrical applications. Its thermal properties and design make it the ideal solution for a variety of different applications.
The specific data is subject to PDF, and the above content is for reference