Thermal - Heat Sinks

Heat sinks are thermal devices designed to maximize the surface area of a component in order to disperse heat. Heat sinks are commonly used in electronics and power systems to maintain the temperature of the component within an acceptable temperature range. In extreme cases, such as in laser or high power radio frequency (RF) systems, heat sinks might even be used to actively cool the system. One of the most common heat sink thermal devices is the ATS-13H-22-C1-R0.

Application Field

ATS-13H-22-C1-R0 are designed mainly for laser systems and aerospace electronics. They are available in sizes ranging from 25mm to 400mm. These are generally used to dissipate the thermal energy generated from high-power lasers. They are also used in high-power RF systems. This type of heat sink offers a low thermal resistance, which allows the heat to flow efficiently from the component into the sink. The aluminum and copper construction also gives them increased durability and a long operating life.

Working Principle

The working principle of the ATS-13H-22-C1-R0 is simple. Heat is created by the dissipating component, and this heat is conducted into the heat sink. The heat sink is designed to increase the surface area available, which in turn allows for a larger volume of air to be exposed to the heat. It also has multiple fins which are designed to create a larger thermal conductive surface area. This thermal conductive area aids in transferring the heat away from the component, thus dissipating it into the air around it.

The air acts as a cooling agent and a convection current is created. This current then carries the heat away from the component, and into the fins of the heat sink. Once the heat has reached the fins, the metal begins to absorb the thermal energy, thus allowing for it to be safely dissipated into the surrounding environment. The fins also act as a conduit, allowing for further heat transfer between the component and the ambient environment.

The aluminum and copper construction of the heat sink help to ensure heat dissipation is more efficient than other materials, and helps to prolong the working life of the thermal device. As a result, a more effective cooling solution is provided to any system in which the ATS-13H-22-C1-R0 is installed.