| Allicdata Part #: | ATS-13H-32-C2-R0-ND |
| Manufacturer Part#: |
ATS-13H-32-C2-R0 |
| Price: | $ 5.81 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X36.83X11.43MM T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13H-32-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.22837 |
| 30 +: | $ 4.93773 |
| 50 +: | $ 4.64726 |
| 100 +: | $ 4.35683 |
| 250 +: | $ 4.06637 |
| 500 +: | $ 3.77592 |
| 1000 +: | $ 3.70330 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 1.450" (36.83mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.450" (11.43mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 21.46°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are thermal components that help dissipate the heat generated from components held at high temperatures, such as processors, transistors, and integrated circuits. The thermal management of these components is important for proper operation and longevity. The ATS-13H-32-C2-R0 is a heat sink designed with materials and configurations to optimize the dissipation of heat away from its constituent components.
The ATS-13H-32-C2-R0 is composed of a number of materials and components. The base of the heat sink is made from aluminum, which offers a strong and lightweight material foundation to support the other components. On the base of the heatsink, there is a serpentine array of metal fins to promote effective heat transfer away from the base. The fins are composed of copper, which offers superior thermal conductivity for improved heat transfer. The fins are arranged in a way that maximizes the surface area available for air to pass over them and cool them.
The base and fins of the ATS-13H-32-C2-R0 are designed for ease of installation. The heat sink can be easily mounted to components that generate high levels of heat, such as CPUs and GPUs. The heat sink includes a mounting clip that can be affixed to the component with screws, and then onto the heat sink for secure mounting. The mounting clip also makes it easier to remove the heat sink for maintenance and replacement.
The ATS-13H-32-C2-R0 heat sink is also designed to operate in a range of environments. Its combination of aluminum and copper allows the sink to withstand temperatures ranging from -40°C to +105°C. The copper fins also create an effective heat transfer interface for dissipating high levels of heat. The combination of materials also allows the heat sink to move air more efficiently, allowing for effective cooling even at low fan speeds.
The ATS-13H-32-C2-R0 is designed to provide a reliable and efficient thermal management solution for many applications, including in industrial controllers, communications systems, and gaming consoles. Its combination of materials and configurations make it an ideal choice for a wide variety of thermal management applications. By dissipating heat away from components efficiently, the ATS-13H-32-C2-R0 ensures that these components continue to operate properly and last longer.
The specific data is subject to PDF, and the above content is for reference