ATS-13H-39-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-13H-39-C1-R0-ND

Manufacturer Part#:

ATS-13H-39-C1-R0

Price: $ 5.49
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 57.9X60.96X5.84MM
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-13H-39-C1-R0 datasheetATS-13H-39-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 4.93920
30 +: $ 4.66473
50 +: $ 4.39022
100 +: $ 4.11585
250 +: $ 3.84146
500 +: $ 3.56707
1000 +: $ 3.49848
Stock 1000Can Ship Immediately
$ 5.49
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Rectangular, Fins
Length: 2.280" (57.90mm)
Width: 2.400" (60.96mm)
Diameter: --
Height Off Base (Height of Fin): 0.230" (5.84mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 18.93°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is an essential component of many electrical and mechanical systems. This is because heat is a byproduct of energy usage and must be carefully managed to ensure that the system or device functions properly. The ATS-13H-39-C1-R0 is a thermal management device designed to help keep temperatures in check.

The ATS-13H-39-C1-R0 is a type of heat sink, which is a device that helps to dissipate heat away from sensitive components. It works by absorbing and conducting heat away from the components while also pulling in cool air from its surroundings. This combination of heat conduction and air cooling helps to keep temperatures balanced.

The ATS-13H-39-C1-R0 is designed for use in a variety of applications, including power electronics, high-frequency circuits, amplifiers, machines, and communications equipment. It\'s a highly efficient device, with a high thermal conductivity rating and a low resistance to air cooling. The device is constructed with a copper base, allowing for maximum heat absorption and dissipation.

In addition, the device can be easily customized to fit various applications. With its quick-release levers, it can be quickly and easily installed in even the most cramped or narrow spaces. Additionally, the device is available in multiple sizes and configurations, allowing for the perfect fit in any system.

The ATS-13H-39-C1-R0 is a reliable and effective solution for thermal management needs. Its combination of heat conduction and air cooling help keep temperatures under control, while its customizable design makes it perfect for any application. From power electronics to high-frequency circuits, the ATS-13H-39-C1-R0 is an effective thermal management solution.

The specific data is subject to PDF, and the above content is for reference

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