| Allicdata Part #: | ATS-13H-70-C3-R0-ND |
| Manufacturer Part#: |
ATS-13H-70-C3-R0 |
| Price: | $ 4.69 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13H-70-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.22163 |
| 30 +: | $ 3.98727 |
| 50 +: | $ 3.75278 |
| 100 +: | $ 3.51823 |
| 250 +: | $ 3.28369 |
| 500 +: | $ 3.04914 |
| 1000 +: | $ 2.99050 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.79°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-13H-70-C3-R0 is a type of thermal-heat sinks, which is mainly used to reduce heat from the surface of hot devices through heat conduction and convection.
Heat sinks are cooling components applied to electronics to help draw away the heat generated and prevent overheating, which can cause device malfunction or even failure.
ATS-13H-70-C3-R0 is one kind of cooling heat sinks, which is designed with multiple fin C shape combined with design to form looped channels, these channels are used to form the hinges between the top and bottom surface to ensure maximum heat transfer and most reliable thermal management.
The main components of Heat Sinks are made of aluminum or cooper. Aluminum has good thermal conductivity, excellent corrosion resistance and is easy to process. Cooper has the best thermal conductivity and a longer lifespan than aluminum, but is more expensive.
The ATS-13H-70-C3-R0 heat sink is mainly composed of the base, fins, clip and other components. The use of finned heat sink can increase the surface area by 1000 times, so that the heat dissipation effect is improved.
The base of the ATS-13H-70-C3-R0 heat sink is made of aluminum and cooper to provide a good connection for the device to be cooled. The base provides the mechanical support for the fin. The fins is made by the multiple fins C shape combined with design. The core component to transfer heat is fin design. By increasing the total heat dissipation area, the heat dissipation effect is improved.
The ATS-13H-70-C3-R0 heat sink is designed to create a loop-back air channel to transfer the heat out of the device that is mounted on the heat sink. The air channel is designed to reduce air back pressure due to air flow, as well as to increase air flow and reduce the amount of air needed to cool the device.
In addition, the design also improves the cooling performance of ATS-13H-70-C3-R0 heat sink. The air channel and fins are designed together to allow for maximum air flow and cooling effect. The air channel also serves as a guide to direct the airflow to the device being cooled. The combination of design and engineering ensures that the heat can be efficiently dissipated enabling the device to operate at lower temperatures and last longer.
The ATS-13H-70-C3-R0 heat sink is widely used in cooling consumer electronic products such as 3D printers, graphics cards, laptops, and other computing devices. Its wide range of usage can be attributed to its strong capabilities for efficient Thermal Management and cost-effectiveness. The finned Heat Sink is popular in industrial markets too, as they are designed to handle various climates and conditions.
In conclusion, the ATS-13H-70-C3-R0 heat sink is an effective and efficient tool for heat management in various electronic and industrial applications. The design of the loop-back air channels and fins provides excellent thermal conduction and maximum heat dissipation.
The specific data is subject to PDF, and the above content is for reference