ATS-13H-76-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	0.984" (25.00mm)
Width:	0.984" (25.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	11.84°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal - Heat Sinks

Heat sinks are thermal management devices used to increase the rate of heat dissipation in electronic components. They come in many shapes and sizes, each designed for a specific application. One such type is the ATS-13H-76-C3-R0 heat sink, and this article will discuss its application field and working principle.In terms of application field, heat sinks are commonly used for cooling down a variety of components in devices such as computers, medical equipment, and electronic devices. In each of these application fields, it is important to select the most efficient and cost-effective heat sink. The ATS-13H-76-C3-R0 has been designed to maximize heat transfer, for instance by helping to increase the cooling capacity of the chip. The ATS-13H-76-C3-R0 can handle chips up to a maximum temperature of 105°C and is capable of dissipating up to 37.5W of heat.The ATS-13H-76-C3-R0 works by taking heat away from a surface and transferring it through a number of fins. This heat is then driven away from the device, allowing the device to work at a safe temperature. The heat sink is made up of a number of copper alloy or aluminum fins that are designed to maximize heat dissipation. The fins are arranged in an intricate and optimized pattern to increase the total surface area. This ensures that the heat transfer from the heat source is maximized.In addition, the ATS-13H-76-C3-R0 heat sink has been designed to increase its cooling efficiency by utilizing a technology known as heat column. Heat column sections allow hot air to rise away from the chip by capturing it and using it to pressurize the heat column. This helps to prevent warm air from recirculating around the chip, which can cause the chip to overheat. In addition to this, the heat column sections also help to increase the airflow across the entire surface of the chip.Finally, the ATS-13H-76-C3-R0 also utilizes a technique called thermal spreader. This is a passive cooling technique which utilizes a thin layer of special material called thermal spreader over the chip. This material effectively acts like a mirror to dissipate heat away from the chip, and its surface area is designed to increase the thermal conductivity of the chip.In conclusion, the ATS-13H-76-C3-R0 heat sink is a highly efficient and cost-effective solution for applications requiring cooling. Its intricate and optimal fin design, heat column sections, and thermal spreader technology work together to effectively dissipate heat away from the device, allowing the device to work safely within its specified temperature range.

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