| Allicdata Part #: | ATS-14A-02-C3-R0-ND |
| Manufacturer Part#: |
ATS-14A-02-C3-R0 |
| Price: | $ 3.60 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X12.7MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14A-02-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.26907 |
| 30 +: | $ 3.18087 |
| 50 +: | $ 3.00422 |
| 100 +: | $ 2.82744 |
| 250 +: | $ 2.65074 |
| 500 +: | $ 2.56237 |
| 1000 +: | $ 2.29730 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.44°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks have a large number of applications in a variety of industries. As a form of heat exchange, these device\'s provide improved performance over traditional solutions by allowing better control over thermal performance.The ATS-14A-02-C3-R0 is a thermal heat sink that is used in various applications. This article will explore the application field and working principles of the ATS-14A-02-C3-R0.
The ATS-14A-02-C3-R0 is a low-profile heat sink, with a height of 14 mm and a base length and width of 70 and 40 mm, respectively. This makes it well-suited for applications that require minimal board space, making it very popular in portable and embedded systems. This small size combined with the copper heat spreader of the ATS-14A-02-C3-R0 make it an ideal candidate for adequate cooling while avoiding the bulky size of conventional heat-sinks.
The ATS-14A-02-C3-R0 is most commonly used to dissipate heat generated by high powered semiconductor devices, such as CPUs and GPUs. Its design provides maximum thermal dissipation, with its large number of fins maximizing surface area for heat transfer. The use of a metal matrix alloy base ensures a better thermal conductivity. In addition, the ATS-14A-02-C3-R0\'s built-in fan increases air flow, and further increases the heat sink\'s thermal performance.
The ATS-14A-02-C3-R0 works on the principle of convection. Heat is generated in the device being cooled, and this heat is drawn away from the device and dissipated into the environment. A passive heat sink relies solely on the ambient air to draw away heat. Here, the copper base and fins of the heat sink act as a thermal conductor, transferring heat away from the device and to the fins, where it can be dissipated into the air. The built-in fan of the ATS-14A-02-C3-R0 further aids in this process, pushing ambient air over the fins and removing heat more quickly.
The ATS-14A-02-C3-R0’s low profile, slim design and efficient heat dissipation makes it suitable for a variety of applications. It can be used in embedded systems in medical, automotive, industrial and telecommunications equipment. It is especially well-suited for use in small handheld devices, such as smartphones, tablets, and portable gaming consoles. Its minimal profile allows for an increase in battery density, reducing the device\'s size and weight. The ATS-14A-02-C3-R0 can also be used to cool motherboards, CPUs and GPUs in desktop and laptop computers.
In conclusion, the ATS-14A-02-C3-R0 is a low-profile thermal heat sink that is well-suited for a variety of applications. Its slim design and efficient heat dissipation makes it a popular choice for minimal board space applications, such us embedded systems, small handheld devices, and motherboards. The ATS-14A-02-C3-R0 works on the principle of convection, with the copper base and fins acting as a thermal conductor to draw heat away from the device and dissipate it into the atmosphere.
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