| Allicdata Part #: | ATS-14A-14-C1-R0-ND |
| Manufacturer Part#: |
ATS-14A-14-C1-R0 |
| Price: | $ 3.68 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X20MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14A-14-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.34026 |
| 30 +: | $ 3.25017 |
| 50 +: | $ 3.06974 |
| 100 +: | $ 2.88912 |
| 250 +: | $ 2.70857 |
| 500 +: | $ 2.61828 |
| 1000 +: | $ 2.34741 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.96°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management has become increasingly important as electronic products become more complex. As a result, heat sinks have become a critical component in the thermal management of electronic components. The ATS-14A-14-C1-R0 is a thermal management device that offers excellent thermal performance for a variety of applications and intermittent operation.
The ATS-14A-14-C1-R0 is a compact, low-profile heat sink designed for applications requiring optimal thermal performance and efficiency. The heat sink features an 8-pin, CSA-certified, thermally-conductive aluminum body with integrated fins to dissipate heat quickly and efficiently. The heat sink includes integrated mounting mechanisms to ensure secure and reliable installation in the desired application. Furthermore, the device offers superior thermal performance, allowing it to work effectively even under demanding conditions.
The ATS-14A-14-C1-R0 is designed for installation in a variety of electronic components such as CPUs, GPUs, ASICs, and other heat-generating components. The device is ideal for applications involving heavier heat dissipation, with its integrated heat-sink technology allowing it to dissipate heat efficiently. The heat sink can also be used in applications involving intermittent operation, as its low-profile design and superior thermal performance can handle the thermal delta during those times when the device retains heat. Furthermore, the heat sink also supports higher operating temperatures, allowing it to remain reliable even in higher-temperature environments.
In addition to its ability to dissipate heat efficiently, the ATS-14A-14-C1-R0 features a variety of other benefits. Its compact design and low-profile size make it ideal for applications where space is limited. Its integrated mounting mechanisms also ensure application-specific customization, allowing it to be easily adjusted and adapted for the desired application.
The ATS-14A-14-C1-R0 is a versatile and efficient thermal management device, providing excellent thermal performance for a variety of applications and intermittent operation. It features a compact design and low-profile size, providing the necessary space-saving benefits. Its integrated fins and mounting mechanisms provide superior thermal performance and easy installation. Additionally, it can support higher operating temperatures, allowing it to remain reliable even in higher-temperature environments. Overall, the ATS-14A-14-C1-R0 is an ideal thermal management device for applications requiring optimal thermal performance and efficiency.
The specific data is subject to PDF, and the above content is for reference