| Allicdata Part #: | ATS-14A-149-C3-R0-ND |
| Manufacturer Part#: |
ATS-14A-149-C3-R0 |
| Price: | $ 3.85 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X20MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14A-149-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.49335 |
| 30 +: | $ 3.29910 |
| 50 +: | $ 3.10502 |
| 100 +: | $ 2.91098 |
| 250 +: | $ 2.71691 |
| 500 +: | $ 2.52285 |
| 1000 +: | $ 2.47433 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.35°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is generally considered important for many industrial and electronic applications, and the ATS-14A-149-C3-R0 is a heat sink that is specifically designed to cool electronic components. The device uses a thermally conductive material to maximize its cooling capabilities and is a highly effective heat dissipation solution for various types of applications. This article provides a detailed overview of the ATS-14A-149-C3-R0 and its applications and working principles.
The ATS-14A-149-C3-R0 is a medium-sized heat sink that is specifically designed for high-performance cooling applications in areas where added airflow is desirable or necessary. The device is constructed with an aerospace-grade aluminum alloy baseplate which is designed for maximum thermal conductivity. The fins are stamped with precision from a machined aluminum alloy stamping die that is also designed to reduce temperatures as well as minimize any micro-surface airflow turbulence. The ATS-14A-149-C3-R0 is typically used for applications that have a high power dissipation requirement, such as in motor drives, power amplifiers, mobile phones, server cabinets, and many other electronic applications that require heat dissipation.
The ATS-14A-149-C3-R0 utilizes a combination of thermal air convection and passive heat pipes to cool electronic components. The device uses air to dissipate the heat generated from the electronic components. Air moves through the fins of the device and the heat generated is transferred away from the components to the fins of the heat sink. The air then rises, carrying the heat away from the device and into the atmosphere. As the air rises, it also cools the components, allowing them to operate at their peak performance levels.
The ATS-14A-149-C3-R0 also utilizes passive heat pipes to enhance the cooling of the device. The heat pipes are filled with a coolant that is designed to rapidly transfer heat from the device to the fins of the device. As the coolant flows through the heat pipes, it absorbs the heat of the components and transfers it to the fins of the device. This provides additional cooling to the device, allowing the components to operate at their peak performance levels.
The ATS-14A-149-C3-R0 is designed with an extensive cooling surface area for maximum cooling efficiency. This helps to ensure that the components remain at their optimal temperature, and increases the device’s longevity. The device also offers a variety of mounting options, allowing for easy installation in virtually any application.
The ATS-14A-149-C3-R0 is a highly efficient and reliable heat sink that is sure to provide effective and consistent cooling for any application. The combination of thermal air convection and passive heat pipes provide an efficient way to cool electronic components in a variety of applications, and the device’s extensive cooling surface area ensures that components remain at their optimal temperatures. The device’s variety of mounting options makes it an ideal heat sink for a wide range of applications, and it is sure to provide reliable and consistent cooling for a long time to come.
The specific data is subject to PDF, and the above content is for reference