| Allicdata Part #: | ATS23305-ND |
| Manufacturer Part#: |
ATS-14A-157-C2-R0 |
| Price: | $ 4.51 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X30MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14A-157-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.10130 |
| 10 +: | $ 3.99042 |
| 25 +: | $ 3.76891 |
| 50 +: | $ 3.54715 |
| 100 +: | $ 3.32545 |
| 250 +: | $ 3.10376 |
| 500 +: | $ 2.88206 |
| 1000 +: | $ 2.82664 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.35°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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A thermal heat sink is a device used to dissipate heat away from an electronic component or device. The ATS-14A-157-C2-R0 is a type of thermal heat sink designed to manage and disperse the heat generated by electronic components and systems. It is a specific type of device with a particular application field and working principle.
This device consists of a heat sink body made from aluminium. It is designed to sit directly on a flat surface and the fins are specifically designed to be close fitting to the component’s surface. As the heat generated by the component or system increases, it will spread out across the surface of the fins and be carried away by the environment as heat transfer. The device is specifically designed to carry away heat, and as such it uses fins that are arranged in a certain way to maximise the transfer of heat away from the component.
The ATS-14A-157-C2-R0 is specified for application in industrial systems and medical facilities. It has long been used in applications such as medical scanners, thermocouples, dental X-rays and other medical equipment. In this type of application the thermal heat sink is being used to manage and dissipate the heat generated by the electronic components and systems in the environment. The specifics of how the heat is managed and dissipated depends on the particular system and components in use.
The working principle behind a thermal heat sink is based on two thermal exchange properties. The first of these is that heat will move from warmer to cooler surfaces. The second is that as heat is dissipated from the source (the component or system) it is transported away, via the fins, into the enviroment. As the heat moves through the fins it is further dissipated by convection and conduction into the environment.
The fins on the ATS-14A-157-C2-R0 are strategically placed to ensure maximum heat transfer. In this respect, the device consists of two sets of fins that are aligned to move heat away from the component. The top set of fins contain small projections that act as contact points for the component. These fins are designed to provide that maximum contact with the surface of the component and therefore carry away the hear as quickly as possible.
In addition to the fins, this device also has a plenum chamber. This is a chamber built into the body of the heat sink that is filled with an air gap. This air gap acts as an extra layer of protection, as it acts as an insulator between the component and the environment. This extra layer of protection helps to ensure that the heat generated by the component is dissipated away from the component as efficiently as possible, providing protection from the damaging effects of thermal distortion.
The ATS-14A-157-C2-R0 is a thermal heat sink specifically designed for industrial and medical facility applications. It has been created to dissipate the heat generated by electronic components and systems, using the principles of thermal exchange and insulation. The device consists of two sets of fins that are arranged in a specific way to ensure heat is quickly and efficiently transferred away from the component and into the environment, with an extra layer of protection provided by the air-filled plenum chamber.
The specific data is subject to PDF, and the above content is for reference