ATS-14A-195-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-14A-195-C1-R0-ND

Manufacturer Part#:

ATS-14A-195-C1-R0

Price: $ 3.13
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X12MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-14A-195-C1-R0 datasheetATS-14A-195-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 2.81736
30 +: $ 2.74134
50 +: $ 2.58905
100 +: $ 2.43671
250 +: $ 2.28446
500 +: $ 2.20830
1000 +: $ 1.97985
Stock 1000Can Ship Immediately
$ 3.13
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.472" (12.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 10.88°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-14A-195-C1-R0 is a high performance heat sink that provides superior heat dissipation for a range of applications including microprocessor, memory and high power RF amplifiers. It is capable of dissipating heat up to a power level of 95W in a wide range of ambient temperatures and has a multi-layer design with a copper base and aluminum fins. The ATS-14A-195-C1-R0 is designed to meet the needs of industrial, automotive, aerospace and medical applications.

Design and Features

The ATS-14A-195-C1-R0 is designed for maximum heat dissipation and has a high thermal conductivity rating of 65W/mK. It is constructed from a copper base and aluminum fins which are soldered together and then coated with special high temperature black coating. The entire assembly has a maximum size of 195 x 195 x 50 mm and a weight of 1,800 g. It also features a patented top plate design that minimizes the gap between the fins and base for improved heat dissipation. Additionally, the ATS-14A-195-C1-R0 has an anodized finish which provides a corrosion resistant surface and greater durability.

Application Field

The ATS-14A-195-C1-R0 is ideal for a range of applications that require high thermal performance. It is suitable for applications such as:

  • Microprocessors
  • Memory
  • High power RF amplifiers
  • Industrial Control Systems
  • Automotive products
  • Aerospace products
  • Medical equipment

The ATS-14A-195-C1-R0 can also be used in high temperature applications such as welding and dyeing. It is ideal for use in applications where heat management is important but space is limited.

Working Principle

The ATS-14A-195-C1-R0 works using the principle of conduction. Heat is transferred from the source, typically a processor or memory, to the heat sink via its copper base. The aluminum fins then dissipate the heat into the surrounding environment. The top plate design ensures a tight contact between the fins and base, This allows for maximum heat transfer efficiency from the base to the fins.

The ATS-14A-195-C1-R0 also features patented air intake and exhaust technology to ensure maximum cooling performance. This ensures that the air flows evenly through the fins for maximum heat dissipation. Additionally, the ATS-14A-195-C1-R0 can be used with a range of fans, allowing for a customized cooling solution.

Conclusion

The ATS-14A-195-C1-R0 is a high performance heat sink suitable for a range of applications that require maximum heat dissipation. With its copper base and aluminum fins, the ATS-14A-195-C1-R0 provides excellent thermal conductivity and durability. It is especially useful for applications in which space is a premium, as its size and weight are very manageable. Additionally, the air intake and exhaust technology ensure that the air flows evenly through the fins for maximum heat dissipation. The ATS-14A-195-C1-R0 is the ideal solution for any thermal management challenge.

The specific data is subject to PDF, and the above content is for reference

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