ATS-14A-197-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-14A-197-C3-R0-ND

Manufacturer Part#:

ATS-14A-197-C3-R0

Price: $ 3.51
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X10MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-14A-197-C3-R0 datasheetATS-14A-197-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.18591
30 +: $ 3.09981
50 +: $ 2.92774
100 +: $ 2.75549
250 +: $ 2.58325
500 +: $ 2.49714
1000 +: $ 2.23882
Stock 1000Can Ship Immediately
$ 3.51
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 11.05°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is one of the most important components of any electronics application. The effectiveness of heat transfer from a component to the outside environment is essential for the proper operation and life of the component. Heat sinks are one of the most common thermal management solutions used today. The ATS-14A-197-C3-R0 is a heat sink designed for a variety of applications. The following will discuss the application fields and working principle of the ATS-14A-197-C3-R0.

Application Fields

The ATS-14A-197-C3-R0 is a heat sink specifically designed for thermal management in high power electronic devices such as power amplifiers, audio equipment, and other components. The design consists of a number of medium-sized fins placed in a radial arrangement that draw away heat using convection cooling. This makes it ideal for applications where an air stream can flow freely.

In addition, the ATS-14A-197-C3-R0 is designed to be used with a variety of other components. It is compatible with a wide array of resistors, capacitors, inductors, and other common designs used in thermal management applications, making it a great choice for those who want a single heat sink that can provide optimum performance in a wide range of situations. Additionally, the ATS-14A-197-C3-R0 is designed to offer long-term reliability and durability, making it a great choice for long term applications.

Working Principle

Heat sinks are designed to draw away heat from electronic components using an air stream. The ATS-14A-197-C3-R0 is designed to do just that, utilizing a number of medium-sized fins to maximize surface area. The increased surface area allows for greater efficiency in convection cooling, as a greater amount of surface area is exposed to the air flow.

In addition, the ATS-14A-197-C3-R0 is designed to offer maximum air flow through the fins. The fins are designed to allow for a significant amount of air to be pulled through, leading to a cooler operating temperature for components. Additionally, the design utilizes multiple layers of fins to ensure that heat is spread evenly across the heat sink, further increasing the heat transfer efficiency.

Finally, the ATS-14A-197-C3-R0 can also be used with a variety of other components. It is compatible with resistors, capacitors, inductors, and other common designs for thermal management applications. This makes it well-suited for many different situations, where a single heat sink must work with many different components.

Conclusion

The ATS-14A-197-C3-R0 is a great choice for high-power electronic applications, providing maximum air flow and heat transfer efficiency with its medium-sized fins and a wide range of compatible components. It is an ideal solution for those who need a single heat sink that offers long-term reliability and durability. As such, the ATS-14A-197-C3-R0 is an excellent choice for those looking to optimize their thermal management solutions.

The specific data is subject to PDF, and the above content is for reference

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