
Allicdata Part #: | ATS-14A-20-C3-R0-ND |
Manufacturer Part#: |
ATS-14A-20-C3-R0 |
Price: | $ 4.67 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 54X54X25MM XCUT T412 |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 4.19895 |
30 +: | $ 3.96543 |
50 +: | $ 3.73225 |
100 +: | $ 3.49896 |
250 +: | $ 3.26570 |
500 +: | $ 3.03243 |
1000 +: | $ 2.97412 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 2.126" (54.01mm) |
Width: | 1.575" (40.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.984" (25.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 7.21°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is essential for electronic equipment and components, as difficult to find working conditions and expose components to the harsh environment of ambient temperature, humidity, corrosion and vibration can lead to decreases in life spans and damage. Heat sinks provide a simple and effective way of cooling electronic components. The ATS-14A-20-C3-R0 heat sink is a standard of performance within the thermal industry.
This particular heat sink is designed for high-power and high-temperature applications where large amounts of heat must be dissipated quickly and reliably. The main purpose of the ATS-14A-20-C3-R0 is to keep the temperature of the system under a set threshold while providing optimal power performance. The heat sink comes with an attractive, black anodized, T series extruded aluminum housing and is capable of dissipating large amounts of heat in a small space. It is also great for applications where a larger heat sink is difficult to find or install.
The ATS-14A-20-C3-R0 heat sink works by applying a thermally conductive material, such as a thermal grease, to the surface of the components to be cooled. This is known as direct contact or direct thermal transfer. In this way, the heat from the components is transferred from the surface of the component to the surface of the heat sink, which dissipates the heat in the ambient environment. This process occurs when the heat from the component is higher than the ambient temperature, resulting in the heat being rejected to the atmosphere or surroundings.
Additionally, this heat sink is designed to be used in environments with high levels of shock and vibration. Its robust construction and design allow it to withstand high levels of vibration without losing its performance characteristics. The heat sink also has the added benefit of helping to reduce noise. This is due to the fact that the direct thermal transfer of heat away from the component will reduce the size of any hot spots in the components, resulting in decreased noise levels.
The ATS-14A-20-C3-R0 is suitable for a wide range of applications and is particularly well-suited for use in high-power, high-temperature applications such as CPUs, GPUs, ASICs, LEDs, and other power-hungry components. In addition, it can also be used in larger applications, such as rack-mounted servers and storage solutions. This heat sink is designed for systems requiring high efficiency, reliability, and thermal performance within their operating temperatures.
The ATS-14A-20-C3-R0 heat sink comes in both a standard and anoverclocked version to accommodate customers who require higher performance. Additionally, it is designed to be fanless, which makes it an ideal choice for customers who require a quiet system. In addition, it is also certified to RoHS standards, making it an environmentally friendly solution.
The ATS-14A-20-C3-R0 heat sink is an excellent choice for customers who require a reliable and efficient solution for high-power and high-temperature applications. Its robust construction and design, combined with its direct heat transfer capabilities, makes it an ideal choice for applications where fanless designs are required and thermal performance is of utmost importance.
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