| Allicdata Part #: | ATS-14A-200-C3-R0-ND |
| Manufacturer Part#: |
ATS-14A-200-C3-R0 |
| Price: | $ 3.81 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14A-200-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.45933 |
| 30 +: | $ 3.36588 |
| 50 +: | $ 3.17898 |
| 100 +: | $ 2.99193 |
| 250 +: | $ 2.80496 |
| 500 +: | $ 2.71146 |
| 1000 +: | $ 2.43095 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.90°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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？Thermal - Heat Sinks are frequently used for a variety of applications that require an efficient transfer of heat from a source to a surface. The ATS-14A-200-C3-R0 is one such heat sink, designed especially for high-powered computing and electronics applications.
ATS-14A-200-C3-R0 Application
The ATS-14A-200-C3-R0 is a sink designed for cooling power electronics. It is able to efficiently move heat from the power electronics or other high-powered device to a thermal surface. The design consists of a series of copper fins on one side of the heatsink base, and a layer of thermally conductive rubber on the other. This design helps the heat sink to effectively capture and transfer heat from the device to its connected heatsink, while still allowing air to circulate through and around the device. The sink can be used in either vertical or horizontal orientation for optimal performance.
ATS-14A-200-C3-R0 Working Principle
The ATS-14A-200-C3-R0’s design provides an effective heat transfer mechanism from the device to the heatsink. When the device generates heat, it is absorbed by the copper fins of the heatsink and then transferred to the base of the heatsink. At the same time, the thermally conductive rubber layer creates an air barrier, allowing the heat to be conducted away from the device, while still allowing air to pass through the holes in the fins. The combination of the copper fins and the thermally conductive rubber creates an effective transfer of the energy generated by the device, to the sinks base, and ultimately to the ambient air.
The ATS-14A-200-C3-R0 is an effective design that provides efficient heat transfer from the device to a connected heatsink. In addition to providing efficient cooling, the design also allows air to circulate around the device, making it an ideal choice for high-powered computing and electronics applications. The design consists of copper fins and a layer of thermally conductive rubber, and when used correctly, can provide superior cooling performance.
The specific data is subject to PDF, and the above content is for reference