| Allicdata Part #: | ATS-14A-30-C1-R0-ND |
| Manufacturer Part#: |
ATS-14A-30-C1-R0 |
| Price: | $ 7.36 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14A-30-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 6.62760 |
| 30 +: | $ 6.25947 |
| 50 +: | $ 5.89138 |
| 100 +: | $ 5.52315 |
| 250 +: | $ 5.15494 |
| 500 +: | $ 4.78673 |
| 1000 +: | $ 4.69468 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.30°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a critical component of most electronics and electrical systems—it is necessary to ensure the proper functioning of the components within it. The ATS-14A-30-C1-R0 heat sink is one such component, designed to dissipate heat from the system in order to keep it cool and safe from damage.
The ATS-14A-30-C1-R0 is a thermally conductive and mechanically robust heat sink designed for use in a wide variety of applications. It has a thermal conductivity of 300W/mK and a thermal resistance of 10-50°C. It is capable of dissipating heat from components up to a temperature of 120°C and is RoHS compliant.
The heat sink consists of a copper and aluminum composite with internal fins that act as carriers for air flow. By increasing the surface area, the air flow is able to pass over the heat sink and help to dissipate the heat generated by the components within the system. The copper core provides excellent thermal conductivity, while the aluminum helps to dissipate the heat rapidly away from the system. It also features a threaded base that can be used to securely attach the heat sink to the component or substrate.
The ATS-14A-30-C1-R0 heat sink is ideal for applications such as cooling computer components, gaming consoles, and even industrial or medical equipment. It is especially suitable for high power and high temperature applications, since it can dissipate up to 120°C. This makes it a great choice for applications that require reliable and efficient thermal management.
The working principle of the ATS-14A-30-C1-R0 is simple but effective. The internal fins increase the surface area to increase air flow across the heat sink. The copper core provides excellent thermal conductivity for efficient heat dissipation, while the aluminum helps to disperse the heat quickly and efficiently. In addition, the threaded base makes it easy to securely attach the heat sink to the component or substrate.
Overall, the ATS-14A-30-C1-R0 heat sink offers excellent thermal management for a wide range of applications. It is capable of dissipating up to 120°C, features a copper and aluminum composite with internal fins, and a threaded base for secure mounting. It is RoHS compliant and ideal for high power and high temperature applications.
The specific data is subject to PDF, and the above content is for reference