| Allicdata Part #: | ATS-14A-32-C2-R0-ND |
| Manufacturer Part#: |
ATS-14A-32-C2-R0 |
| Price: | $ 5.81 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X36.83X11.43MM T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14A-32-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.22837 |
| 30 +: | $ 4.93773 |
| 50 +: | $ 4.64726 |
| 100 +: | $ 4.35683 |
| 250 +: | $ 4.06637 |
| 500 +: | $ 3.77592 |
| 1000 +: | $ 3.70330 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 1.450" (36.83mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.450" (11.43mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 21.46°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-14A-32-C2-R0 application field and working principle
ATS-14A-32-C2-R0, an international standard thermal appliance that belongs to the category of heat sinks, is widely used in various heating parts, electrical circuit boards, power supplies, and other electronic appliances requiring efficient thermal dissipation. As a thermal appliance, its essential role is to transfer heat away from a component or system to help maintain an optimal operating temperature, saving the components from failure due to excessive temperature.
Heat sinks, of which the ATS-14A-32-C2-R0 is one, are generally constructed of aluminum alloy material, resulting in excellent thermal conductivity and heat radiation performance. With its optimized structure, the ATS-14A-32-C2-R0 can quickly and efficiently dissipate the generated heat from its own heating element or other related components to the surrounding air, reducing their operating temperature and ultimately reducing temperature stress from the components to avoid any damage that might be caused overheat.
The ATS-14A-32-C2-R0 also provides an efficient way to transfer heat away from its heating element with high temperature rising. As it features higher heat capacity than aluminum alloy material, the substrate of the heat sink device to provides better heat dissipation performance and allows for a faster, more uniform cooling. With its unique shape and designed air flow channel structure, the ATS-14A-32-C2-R0 promote the top-bottom air convection of the device, leading to a better thermal conductivity for the device.
In addition, ATS-14A-32-C2-R0 is also designed with an adjustable flip-chip clip for quick and easy removal and replacement for a wide variety of heating elements including CPU, GPU, memory chips, hard disk drives, and other electrical circuits that require high level of thermal conductivity. Furthermore, its internal structure also designed for uniform thermal conductivity for an even distribution in order to prevent any spots within the device from accumulating too much heat.
In conclusion, the ATS-14A-32-C2-R0 active thermal management system is an efficient and cost effective thermal solution which can provide excellent thermal dissipation and heat transfer efficiency. With its adjustable design and advanced structure providing excellent heat that is quickly channeled away from electronics, this thermal appliance is a reliable and attractive solution for many electronic components requiring efficient thermal management.
The specific data is subject to PDF, and the above content is for reference