ATS-14A-78-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	0.984" (25.00mm)
Width:	0.984" (25.00mm)
Diameter:	--
Height Off Base (Height of Fin):	1.378" (35.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	7.71°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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ATS-14A-78-C2-R0 Thermal - Heat Sinks Application Field and Working PrincipleThe ATS-14A-78-C2-R0 thermal - heat sink is a type of cooling device used to dissipate heat generated by electrical and electronic components. The ATS-14A-78-C2-R0 uses thermal conductivity and convection to reduce the operating temperature of components in an electronic system. As such, it is a key component that is critical in cooling and protecting sensitive electronic components. The ATS-14A-78-C2-R0 is a thermally efficient heat sink which helps to dissipate heat away from components without adding a significant amount of additional noise or vibration. The Performance of the ATS-14A-78-C2-R0 is based on anair/fin type cooling design that has fins closely spaced to increase surface area for better dissipation of heat. This type of heat sink maximizes air flow around the component for optimal heat transfer.The ATS-14A-78-C2-R0 is typically seen in a variety of electronic designs, including computers, cell phones, laptops, and other digital systems. It is also used in various industrial markets since it is able to dissipate heat away from sensitive components. The ATS-14A-78-C2-R0 can provide a reliable and cost-effective solution for passively cooling components in conditions where active cooling may not be available.The ATS-14A-78-C2-R0 is made out of an aluminum alloy that has been extruded to create a heat sink that has alongervapor chamber with fins along the length to increase thermal performance. This combination of materials and design ensures that air can move quickly across the length of the heat sink providing maximum heat transfer and cooling effects. The working principle behind the ATS-14A-78-C2-R0 is fairly simple. Heat is absorbed by the heat sink and then dissipated through thermal conduction and convection. When the heat sink absorbs heat from the components in an electronic design, it transfers the heat to the fins which are in direct contact with the air. This flow of heat is caused by convection which transports heat away from the components to be cooled. The fins on the ATS-14A-78-C2-R0 act as a vector by amplifying convection through all of their small peaks and valleys. This type of heat transfer efficiently pulls heat away from the components, reducing their operating temperatures. The airflow created by the fins is typically assisted by the use of a fan or other cooling methods.In addition, the ATS-14A-78-C2-R0’s effects can be enhanced by a variety of other power management and cooling solutions. For example, applying heat sinks or connecting multiple coolers together can increase thermal performance. Heat pipes are also often used in conjunction with heat sinks in order to transfer heat away from critical components more quickly and efficiently.Overall, the ATS-14A-78-C2-R0 thermal - heat sink is a very efficient cooling solution for all types of electronic designs. It is able to dissipate heat from components quickly and reliably and its ability to be paired with other cooling solutions makes it an ideal choice for a variety of applications.

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