ATS-14A-81-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS23412-ND

Manufacturer Part#:

ATS-14A-81-C2-R0

Price: $ 3.82
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 30X30X20MM R-TAB T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-14A-81-C2-R0 datasheetATS-14A-81-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 3.47760
10 +: $ 3.38814
25 +: $ 3.29666
50 +: $ 3.11346
100 +: $ 2.93026
250 +: $ 2.74713
500 +: $ 2.65555
1000 +: $ 2.38083
Stock 1000Can Ship Immediately
$ 3.82
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.181" (30.00mm)
Width: 1.181" (30.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 14.03°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-14A-81-C2-R0 is a type of Thermal - Heat Sink designed to provide the user with maximum cooling of the system components. The ATS-14A-81-C2-R0 is designed to dissipate heat, which is generated from electronic components in a system, to increase the system’s overall cooling efficiency.

The ATS-14A-81-C2-R0 is designed to be used with air cooled systems, using either natural convection, forced air cooling, or other forms of air cooling, to increase the overall cooling efficiency of the system. The ATS-14A-81-C2-R0 is capable of dissipating heat at rates up to twenty times greater than other thermal – heat sinks of comparable size. The device is capable of dissipating even more heat if additional cooling is provided to the system.

The ATS-14A-81-C2-R0 utilizes a unique fin and pin design which is based on the single-stage pin fin technology. The fin and pin design is designed to increase the surface area of the heat dispersion area. This increased surface area increases the rate at which heat is transferred away from the device. In addition, the ATS-14A-81-C2-R0 is equipped with a special heat sink coatings. The coatings consists of a combination of aluminum and copper which increase the surface area over which the heat can be dispersed.

The ATS-14A-81-C2-R0 also comes with several mounting options. The unit can be mounted directly onto the system board, or it can be mounted on a variety of other surfaces. The unit can also be mounted in an open or closed environment depending on the application requirements. The ATS-14A-81-C2-R0 is designed to be compatible with most standard component systems, as well as systems used in a range of applications.

The ATS-14A-81-C2-R0 is an effective way to cool system components. By dissipating the heat generated by the components, the ATS-14A-81-C2-R0 helps to keep the system running at its optimal temperature. This helps to ensure that the system components are able to perform at their peak performance level. The unit is also easy to install and maintain, meaning that the user does not have to worry about the device requiring any additional modifications. The unit is lightweight and durable, and is designed to provide the user with maximum cooling.

The specific data is subject to PDF, and the above content is for reference

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