| Allicdata Part #: | ATS-14A-81-C3-R0-ND |
| Manufacturer Part#: |
ATS-14A-81-C3-R0 |
| Price: | $ 3.65 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X20MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14A-81-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.31695 |
| 30 +: | $ 3.22707 |
| 50 +: | $ 3.04781 |
| 100 +: | $ 2.86858 |
| 250 +: | $ 2.68930 |
| 500 +: | $ 2.59965 |
| 1000 +: | $ 2.33071 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.22°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-14A-81-C3-R0 thermal-heat sink is a type of advanced cooling device used to manage thermal energy in electronic systems. It is primarily used in high-end computers and other electronic components that require cooling to prevent performance degradation or system failure. The ATS-14A-81-C3-R0 thermal-heat sink is a passive heat-transfer device that uses both thermal conduction and thermal convection to dissipate heat from its components. The ATS-14A-81-C3-R0 thermal-heat sink consists of a metal base plate which acts as a heat spreader and multiple fins which extend out from the base plate.
The ATS-14A-81-C3-R0 thermal-heat sink works by dissipating thermal energy from the top component to the fins of the heat sink. The thermal energy is then transferred through the fins and into the metal base plate where it is dissipated by thermal conduction. When the thermal energy reaches the base plate it is then dissipated into the surrounding air by thermal convection. The base plate is attached to a heatsink frame which is then attached to the source of the thermal energy, such as a processor or other component. This allows the thermal energy to be dissipated more effectively and quickly than with traditional fan-type cooling devices. Additionally, the ATS-14A-81-C3-R0 thermal-heat sink does not require any additional power source to work.
The ATS-14A-81-C3-R0 thermal-heat sink is typically used in high-end electronic components such as processors, video cards, and other high powered electronic systems. It is also used in military and aerospace applications. The ATS-14A-81-C3-R0 thermal-heat sink is designed for high-end cooling of components that require superior thermal performance.
The ATS-14A-81-C3-R0 thermal-heat sink is a high performance cooling device that provides superior thermal performance in a low profile package. It is easy to install and maintain and requires no external power source. The ATS-14A-81-C3-R0 thermal-heat sink is designed to optimize thermal management in high-end computer systems and other electronic components. The ATS-14A-81-C3-R0 thermal-heat sink is a cost-effective solution for high performance thermal management in a wide variety of electronic components and systems.
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