| Allicdata Part #: | ATS23440-ND |
| Manufacturer Part#: |
ATS-14B-10-C2-R0 |
| Price: | $ 4.19 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: | ATS-14B-10-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.80520 |
| 10 +: | $ 3.70125 |
| 25 +: | $ 3.49574 |
| 50 +: | $ 3.29011 |
| 100 +: | $ 3.08448 |
| 250 +: | $ 2.87885 |
| 500 +: | $ 2.67322 |
| 1000 +: | $ 2.62181 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.89°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
Heat sinks are devices used to transfer heat generated by an electronic or mechanical component to a more thermally tolerant environment. One of the most common heat sink designs used in electronics is the ATS-14B-10-C2-R0. This heat sink design features a large base for improved thermal contact with the device, as well as a number of fins for greater surface area and heat dissipation.
The ATS-14B-10-C2-R0 can be used in virtually any application where heat must be managed, including industrial, consumer, automotive, and aerospace products. In all of these application fields, the thermal management capabilities of this heat sink will allow the necessary components to run more efficiently while maintaining the correct temperature.
The primary working principle of the ATS-14B-10-C2-R0 is based on the concept of convection. This refers to the transfer of heat from the surface of the heat sink into the atmosphere. As the temperature of the heat sink increases, the air near the surface is heated. This hot air rises due to its lower density, and cooler air is then drawn into the heat sink to replace it. This cycle continues, allowing the heat sink to dissipate the heat it was designed to manage.
The ATS-14B-10-C2-R0 is designed to provide reliable thermal management with minimal complexity. The heat sink\'s large base ensures maximum contact with the device it is cooling, while the fins provide a greater surface area for heat transfer. This combination ensures the efficient transfer of heat and consequently provides better protection for the device. The ATS-14B-10-C2-R0 is an ideal solution for thermal management applications as it offers both high performance and cost-effectiveness.
The specific data is subject to PDF, and the above content is for reference
ATS-14B-10-C2-R0 Datasheet/PDF