| Allicdata Part #: | ATS-14B-12-C1-R0-ND |
| Manufacturer Part#: |
ATS-14B-12-C1-R0 |
| Price: | $ 3.48 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X12.7MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14B-12-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.16197 |
| 30 +: | $ 3.07671 |
| 50 +: | $ 2.90581 |
| 100 +: | $ 2.73489 |
| 250 +: | $ 2.56397 |
| 500 +: | $ 2.47851 |
| 1000 +: | $ 2.22211 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.84°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks
A heat sink is designed to remove heat from an electronic component or device and transfer it to the surrounding air using convection, radiation, or a combination of the two. It is an integral component of many modern electronic devices, such as computers, smartphones, and electronic appliances. When it comes to cooling solutions, heat sinks are among the most widely used. They are typically made from materials such as aluminum, copper, or plastic, and are designed to be easy to install and provide effective cooling.
The ATS–14B–12–C1–R0 is a type of heat sink designed for use in electronic circuitry. It is an aluminum heat sink with a base measuring 14mm by 12mm, and a total height of 1.2mm. The ATS–14B–12–C1–R0 is designed to be used in high-frequency applications that require good thermal performance, such as power amplifiers. It is especially effective in applications that require fast cooling, as its flat design and large surface area make it able to dissipate large amounts of heat quickly and efficiently.
The ATS–14B–12–C1–R0 is designed to work using a combination of thermal radiation and convection. Thermal radiation is the emission of energy from heat as electromagnetic waves. As the heat transfer rate increases, the heat sink absorbs more heat from the surrounding air, causing the air temperature to rise. This hot air rises, carrying with it the heat that was absorbed by the heat sink, and is replaced with cooler air from below. This process of convection helps to continuously cool the heat sink and its surrounding area.
The effective usage of a heat sink requires that it be attached to the electronic device or component that is generating the heat in the first place. It can be mounted directly onto the component, or it can be mounted onto a daughter board or back plate that needs to be connected to the component. Either way, the heat sink needs to be securely attached in order to ensure that it is properly transferring the heat from the component.
The ATS–14B–12–C1–R0 is a great choice for anyone seeking an effective and efficient cooling solution. Its small size and lightweight design make it easy to install and installers won’t need to worry about the space it takes up as it is only 1.2mm tall. The combination of thermal radiation and convection ensures that the heat sink is able to quickly and efficiently disperse the heat generated from electronic devices, which helps to keep them running smoothly and optimally.
The specific data is subject to PDF, and the above content is for reference